The vacuum chamber is an important part of microparticle optical levitation technology. The traditional vacuum chamber has a large volume and many peripheral components, which cannot meet the requirements of miniaturization and on-chip optical levitation technology. Therefore, this study proposes a novel microparticle vacuum chamber based on the micro-electro-mechanical system (MEMS) process. This MEMS microparticle vacuum chamber adopts a “glass-silicon-glass” three-layer vacuum bonding process, with a volume of only 15 mm × 12 mm × 1.2 mm, including particle chamber, cantilever resonator chamber, and getter chamber, which can encapsulate microparticles in a tiny vacuum environment and realize optical levitation of microparticles. At the s...
Data for the paper "Hybrid electro-optical trap for experiments with levitated particles in vacuum"E...
Packaging of MEMS is an important expense factor within the production costs and, to ensure mass pro...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
In the paper MEMS-type microsystems working in vacuum conditions are described. All the benefits and...
Many scientific instruments require a reduced pressure environment for operation. Recent development...
Vacuum packaging is very important for sonic micro-electro-mechanical systems (MEMS) devices to perf...
Developing packaging technology is one of the most important tasks to improve the performance of MEM...
This thesis reports how prototypes of micromachined vacuum sensors were designed, fabricated and cha...
Journal ArticleThe batch fabrication and test of artificial optical resonator slab-type micro parti...
This paper reports the measured electrical and mechanical properties of micromachined vacuum cavity ...
A wafer-level vacuum package with silicon bumps and electrical feedthroughs on the cap wafer is deve...
A new technique for levitating solid particles inside a vacuum chamber is developed using a proton b...
SIGLEAvailable from British Library Document Supply Centre- DSC:8053.4153(RAL--90-076) / BLDSC - Bri...
Vacuum packaging is very important for some micro-electro-mechanical systems (MEMS) devices to perfo...
Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured u...
Data for the paper "Hybrid electro-optical trap for experiments with levitated particles in vacuum"E...
Packaging of MEMS is an important expense factor within the production costs and, to ensure mass pro...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
In the paper MEMS-type microsystems working in vacuum conditions are described. All the benefits and...
Many scientific instruments require a reduced pressure environment for operation. Recent development...
Vacuum packaging is very important for sonic micro-electro-mechanical systems (MEMS) devices to perf...
Developing packaging technology is one of the most important tasks to improve the performance of MEM...
This thesis reports how prototypes of micromachined vacuum sensors were designed, fabricated and cha...
Journal ArticleThe batch fabrication and test of artificial optical resonator slab-type micro parti...
This paper reports the measured electrical and mechanical properties of micromachined vacuum cavity ...
A wafer-level vacuum package with silicon bumps and electrical feedthroughs on the cap wafer is deve...
A new technique for levitating solid particles inside a vacuum chamber is developed using a proton b...
SIGLEAvailable from British Library Document Supply Centre- DSC:8053.4153(RAL--90-076) / BLDSC - Bri...
Vacuum packaging is very important for some micro-electro-mechanical systems (MEMS) devices to perfo...
Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured u...
Data for the paper "Hybrid electro-optical trap for experiments with levitated particles in vacuum"E...
Packaging of MEMS is an important expense factor within the production costs and, to ensure mass pro...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...