Our research objective is to realize the basic technology for a next generation package-level power grid (PLPG) for plural application large scale integrated circuits (LSIs). In this study, a carbonyl-iron powder (CIP)/epoxy composite magnetic core, for large-current power inductor used for the main dc-dc converter in the PLPG, has been fabricated and evaluated. 54 vol.%-CIP/epoxy composite core made by screen-printing had a relative permeability of 7.5 and loss tangent of about 0.03 at 100 MHz. The planar power inductor using composite core was fabricated and evaluated, which had a quasi closed magnetic circuit consisting of low permeability composite core and embedded 35-mu m-thick, two-turn copper spiral coil. The fabricated inductor wit...
Author name used in this publication: K. W. E. ChengRefereed conference paper2006-2007 > Academic re...
This paper reports a new fabrication process that can be used to integrate high-power-density and lo...
This paper details the design, assembly, and detailed characterization of Printed Circuit Board (PCB...
To realize the basic technology of a package-level dc power grid for the next generation power deliv...
Recently, research and development of integrated low-voltage dc-dc converter to LSIs has been active...
This paper details the design, assembly, and detailed characterization of Printed Circuit Board (PCB...
This thesis is focused on the investigation of magnetic materials for high-power dcdc converters in ...
The integration of power inductors is a roadblock in realizing highly miniaturized power supply in p...
Power conversion circuitry is an integral part of electronic devices such as in handheld mobile devi...
In this letter, a novel integrated power inductor with a vertical laminated NiFe magnetic core for i...
Renewable energy has been the topic of interest and research in recent years, especially so in power...
This article presents a timely report on 3D printed cobalt iron (CoFe) soft magnetic cores enabled b...
The emerging need for smart and wearable electronic systems are driving new electronics technology p...
This paper discusses the integration of magnetic components (inductors and transformers) into MCM-L ...
Increasing switching frequency, enabled by advances in discrete silicon switches, monolithic CMOS/LD...
Author name used in this publication: K. W. E. ChengRefereed conference paper2006-2007 > Academic re...
This paper reports a new fabrication process that can be used to integrate high-power-density and lo...
This paper details the design, assembly, and detailed characterization of Printed Circuit Board (PCB...
To realize the basic technology of a package-level dc power grid for the next generation power deliv...
Recently, research and development of integrated low-voltage dc-dc converter to LSIs has been active...
This paper details the design, assembly, and detailed characterization of Printed Circuit Board (PCB...
This thesis is focused on the investigation of magnetic materials for high-power dcdc converters in ...
The integration of power inductors is a roadblock in realizing highly miniaturized power supply in p...
Power conversion circuitry is an integral part of electronic devices such as in handheld mobile devi...
In this letter, a novel integrated power inductor with a vertical laminated NiFe magnetic core for i...
Renewable energy has been the topic of interest and research in recent years, especially so in power...
This article presents a timely report on 3D printed cobalt iron (CoFe) soft magnetic cores enabled b...
The emerging need for smart and wearable electronic systems are driving new electronics technology p...
This paper discusses the integration of magnetic components (inductors and transformers) into MCM-L ...
Increasing switching frequency, enabled by advances in discrete silicon switches, monolithic CMOS/LD...
Author name used in this publication: K. W. E. ChengRefereed conference paper2006-2007 > Academic re...
This paper reports a new fabrication process that can be used to integrate high-power-density and lo...
This paper details the design, assembly, and detailed characterization of Printed Circuit Board (PCB...