Simple Method for Fabrication of Three-Dimensional (3D) Copper Nanostructured Architecture by Electrodeposition

Three-dimensional (3D) copper nanostructured architectures were fabricated on a copper substrate using a simple electrodeposition technique. An acid copper sulfate bath was used for copper plating with polyacrylic acid (PA) as an additive and electrodeposition was performed under galvanostatic conditions. The surface morphology of the electrodeposited copper films was significantly changed and a 3D nanostructured architecture that consisted of highly porous 50 nm thick sheet-like copper deposits was obtained by the addition of PA. It is considered that such a 3D nanostructured architecture could be applied as a current collector for lithium-ion battery anodes.ArticleECS ELECTROCHEMISTRY LETTERS. 3(5):D7-D9 (2014)journal articl