Cu thin films are nowadays attractive components for emergent MEMS based technologies because their high electrical conductivity (σ) and good mechanical properties. In general, σ is negatively affected when the film thickness (t) decreases close to the electron mean free path (le) scale and the mechanical resistance is favored. So, we propose a study of the Cu thin films optimum size conditions to achieve a well-compromise between the mechanical and electrical performance. Films mechanical behavior was studied by Atomic Force Microscopy (AFM) assisted nanoindentation. Results showed considerable increments of the elastic (Ue)-to-total (Ut) strain energy ratios (Ue/Ut) from 0.27 ± 0.02 up to 0.54 ± 0.04 as t was decreased from 2 [µm] to 100 ...
With continued shrinking of CMOS technology to reduce the gate delay times, an increase in the resis...
The phenomenon of resistive switching is based on nanoscale changes in the electrical properties of ...
In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
Epitaxial nanotwinned Cu films, with an average twin spacing ranging from 7 to 16 nm, exhibit a high...
We investigate the elasto-plastic deformation properties of a 20-nm-thick copper (Cu) thin film. A n...
We investigate the elasto-plastic deformation properties of a 20-nm-thick copper (Cu) thin film. A n...
As there is a need to increase the number of transistors while lowering chip dimensions and reducing...
Improving the interface stability for nanosized thin films on brittle substrates is crucial for tech...
L’évolution de la technologie microélectronique conduit à une densité d’intégration toujours plus fo...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
Flexible and soft conductive thin film using pure Cu and Cu-based oxide nanostructures equally benef...
This article reports the impact of nanovoids on macro-properties and its underlying physical mechani...
Crystal orientation mapping in the transmission electron microscope was used to quantify the twin bo...
Residual electrical resistivitymeasurement is employed to study dislocation storage under tensile lo...
With continued shrinking of CMOS technology to reduce the gate delay times, an increase in the resis...
The phenomenon of resistive switching is based on nanoscale changes in the electrical properties of ...
In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
Epitaxial nanotwinned Cu films, with an average twin spacing ranging from 7 to 16 nm, exhibit a high...
We investigate the elasto-plastic deformation properties of a 20-nm-thick copper (Cu) thin film. A n...
We investigate the elasto-plastic deformation properties of a 20-nm-thick copper (Cu) thin film. A n...
As there is a need to increase the number of transistors while lowering chip dimensions and reducing...
Improving the interface stability for nanosized thin films on brittle substrates is crucial for tech...
L’évolution de la technologie microélectronique conduit à une densité d’intégration toujours plus fo...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
Flexible and soft conductive thin film using pure Cu and Cu-based oxide nanostructures equally benef...
This article reports the impact of nanovoids on macro-properties and its underlying physical mechani...
Crystal orientation mapping in the transmission electron microscope was used to quantify the twin bo...
Residual electrical resistivitymeasurement is employed to study dislocation storage under tensile lo...
With continued shrinking of CMOS technology to reduce the gate delay times, an increase in the resis...
The phenomenon of resistive switching is based on nanoscale changes in the electrical properties of ...
In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X...