This paper established a new kind of polyimide/C-MXene composite films with a microcellular structure for electromagnetic interference shielding through solution mixing and liquid phase separation methods. Polyimide was used as the resin material, Ti3C2Tx MXene was used as the electromagnetic wave-shielding medium, l-citrulline was used as the surface modification agent, ferric trichloride (especially the ferric ion) was used as the cross-linking agent between the polyimide and modified C-MXene, and a microcell was used as the shielding structure. By adjusting the content of ferric ions, the foam structure, mechanical properties, thermal conductivity, and electromagnetic interference shielding efficiency of the polyimide/C-MXene microcellul...
A flexible electromagnetic interference (EMI) shielding film was innovatively fabricated using both ...
Novel high-performance polyetherimide (PEI)/graphene@Fe<sub>3</sub>O<sub>4</sub> (G@Fe<sub>3</sub>O<...
There is an urgent need for interlayer dielectric materials with ultralow dielectric properties, hig...
In order to overcome the various defects caused by the limitations of solid metal as a shielding mat...
The conductive polymer composite (CPC) foams are always accompanied with obvious reflection of EM wa...
Research and development of two-dimensional materials such as MXene made great progress due to its v...
Abstract Lightweight microcellular polyurethane (TPU)/carbon nanotubes (CNTs)/ nickel-coated CNTs (N...
Interest has been growing in electromagnetic interference (EMI) shielding materials in view of soari...
The construction of abundant pore channels between the layers of Ti3C2Tx MXene film is an important ...
Limiting factor to computer chip speed and size is the dielectric constant of the interlayer insulat...
Due to the high value of its dielectric constant, polyimide does not meet the requirements of the de...
The aim of this research was to develop polymer-electrolyte membrane on the base of commercial polyi...
Herein Kapton-type aromatic polyimide (PI) composite foams with reduced graphene oxide (rGO) content...
Lightweight, ultrathin, and flexible electromagnetic interference (EMI) shielding materials with hig...
International audienceAbstract The colossal development of modern electronic devices has inevitably ...
A flexible electromagnetic interference (EMI) shielding film was innovatively fabricated using both ...
Novel high-performance polyetherimide (PEI)/graphene@Fe<sub>3</sub>O<sub>4</sub> (G@Fe<sub>3</sub>O<...
There is an urgent need for interlayer dielectric materials with ultralow dielectric properties, hig...
In order to overcome the various defects caused by the limitations of solid metal as a shielding mat...
The conductive polymer composite (CPC) foams are always accompanied with obvious reflection of EM wa...
Research and development of two-dimensional materials such as MXene made great progress due to its v...
Abstract Lightweight microcellular polyurethane (TPU)/carbon nanotubes (CNTs)/ nickel-coated CNTs (N...
Interest has been growing in electromagnetic interference (EMI) shielding materials in view of soari...
The construction of abundant pore channels between the layers of Ti3C2Tx MXene film is an important ...
Limiting factor to computer chip speed and size is the dielectric constant of the interlayer insulat...
Due to the high value of its dielectric constant, polyimide does not meet the requirements of the de...
The aim of this research was to develop polymer-electrolyte membrane on the base of commercial polyi...
Herein Kapton-type aromatic polyimide (PI) composite foams with reduced graphene oxide (rGO) content...
Lightweight, ultrathin, and flexible electromagnetic interference (EMI) shielding materials with hig...
International audienceAbstract The colossal development of modern electronic devices has inevitably ...
A flexible electromagnetic interference (EMI) shielding film was innovatively fabricated using both ...
Novel high-performance polyetherimide (PEI)/graphene@Fe<sub>3</sub>O<sub>4</sub> (G@Fe<sub>3</sub>O<...
There is an urgent need for interlayer dielectric materials with ultralow dielectric properties, hig...