Passive, gravity-driven thermosyphons represent a stepchange in technology towards the goal of greatly reducing PUE (Power Usage Effectiveness) of datacenters by replacing energy hungry fans of air-cooling approach with a highly-reliable solution able to dissipate the rising heat loads demanded in a cost-effective manner. The European Union has launched a zero carbon-footprint target for datacenters by the timeline of 2030, which would include new standards for implementing green solutions. In the present study, a newly updated version of the general thermosyphon simulation code previously presented at InterPACK 2019 and InterPACK 2020 is considered. To facilitate the industrial transition to thermosyphon cooling technology, with its intrin...
THESIS 10987Improved cooling technologies are becoming necessary in electronic applications, specifi...
ABSTRACT Spaces with high heat generation such as telecommunication base stations (TBS) increase sha...
With the ever rapid advances in silicon chip technology, heat fluxes from high speed electronic devi...
This paper advances the state-of-the-art in novel passive two-phase systems for more efficient cooli...
In the present study, a simulation code specifically developed to evaluate the thermal-hydraulic per...
Efficient, small, state-of-the-art passive cooling two-phase systems, i.e. advanced micro-thermosyph...
A warm model has been created to concentrate on the warm conduct of Thermosyphon incorporated Heat S...
AbstractIntegrated system of mechanical refrigeration and thermosyphon (ISMT) is an ideal solution f...
International audienceThis paper presents an analytical model for a thermosyphon loop developed for ...
With the rapid development of electronic devices, internal heat generation in these devices becomes ...
Over the years, heat fluxes from high speed electronic devices are increasing at an alarming rate...
The power density and, consequently, power hungriness of server processors is growing by the day. Tr...
This paper advances the work presented at ITHERM 2020 where a novel passive two-phase technology was...
With rapid development of the semiconductor technology, more efficient cooling systems for elec-tron...
Cooling of portable electronic modules becomes more challenging as the ever increasing integration o...
THESIS 10987Improved cooling technologies are becoming necessary in electronic applications, specifi...
ABSTRACT Spaces with high heat generation such as telecommunication base stations (TBS) increase sha...
With the ever rapid advances in silicon chip technology, heat fluxes from high speed electronic devi...
This paper advances the state-of-the-art in novel passive two-phase systems for more efficient cooli...
In the present study, a simulation code specifically developed to evaluate the thermal-hydraulic per...
Efficient, small, state-of-the-art passive cooling two-phase systems, i.e. advanced micro-thermosyph...
A warm model has been created to concentrate on the warm conduct of Thermosyphon incorporated Heat S...
AbstractIntegrated system of mechanical refrigeration and thermosyphon (ISMT) is an ideal solution f...
International audienceThis paper presents an analytical model for a thermosyphon loop developed for ...
With the rapid development of electronic devices, internal heat generation in these devices becomes ...
Over the years, heat fluxes from high speed electronic devices are increasing at an alarming rate...
The power density and, consequently, power hungriness of server processors is growing by the day. Tr...
This paper advances the work presented at ITHERM 2020 where a novel passive two-phase technology was...
With rapid development of the semiconductor technology, more efficient cooling systems for elec-tron...
Cooling of portable electronic modules becomes more challenging as the ever increasing integration o...
THESIS 10987Improved cooling technologies are becoming necessary in electronic applications, specifi...
ABSTRACT Spaces with high heat generation such as telecommunication base stations (TBS) increase sha...
With the ever rapid advances in silicon chip technology, heat fluxes from high speed electronic devi...