This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were re...
This paper examines two methods of assembling electronics SMD components on flexible substrates with...
This paper presents an evaluation of isotropic and anisotropic conductive adhesives for flip chip ap...
This article presents a novel approach for the electrical interconnection of embroidered conductive ...
This article addresses the research and development of a reliable interconnection technique for moun...
This article addresses the higher temperature washing reliability research of interconnection techni...
This article addresses the real-life functional research of electrically conductive joints of SMD co...
Integration of electronics into textiles needs two connection steps. On the one hand, the mechanical...
For over two decades different types of fabric circuits have been developed. These are fabrics with ...
The article presents a research focused on reliability testing of glued joints on conductive textile...
Electrically conductive adhesives offer a low-temperature alternative for soldering process in elect...
The paper deals with temperature ageing reliability of joints glued by non-conductive adhesive (NCA)...
This paper is focused on the interconnection and joining of electronic modules by conductive textile...
This paper presents a new technology to connect electronic modules with textile circuits in a cost e...
This paper presents a technology to integrate electronics at the thread level in woven textiles. Fle...
The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid...
This paper examines two methods of assembling electronics SMD components on flexible substrates with...
This paper presents an evaluation of isotropic and anisotropic conductive adhesives for flip chip ap...
This article presents a novel approach for the electrical interconnection of embroidered conductive ...
This article addresses the research and development of a reliable interconnection technique for moun...
This article addresses the higher temperature washing reliability research of interconnection techni...
This article addresses the real-life functional research of electrically conductive joints of SMD co...
Integration of electronics into textiles needs two connection steps. On the one hand, the mechanical...
For over two decades different types of fabric circuits have been developed. These are fabrics with ...
The article presents a research focused on reliability testing of glued joints on conductive textile...
Electrically conductive adhesives offer a low-temperature alternative for soldering process in elect...
The paper deals with temperature ageing reliability of joints glued by non-conductive adhesive (NCA)...
This paper is focused on the interconnection and joining of electronic modules by conductive textile...
This paper presents a new technology to connect electronic modules with textile circuits in a cost e...
This paper presents a technology to integrate electronics at the thread level in woven textiles. Fle...
The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid...
This paper examines two methods of assembling electronics SMD components on flexible substrates with...
This paper presents an evaluation of isotropic and anisotropic conductive adhesives for flip chip ap...
This article presents a novel approach for the electrical interconnection of embroidered conductive ...