Add to ORKGThe propagation of high-speed differential signals on interconnects is simulated by means of SPICE-like equivalent circuits. Both conductor and dielectric losses are accounted for, along with the effects of dispersion. The suitability and the accuracy of the proposed models for the extraction of typical information required for the design of interconnect, e.g. the eye-diagram and the scattering parameters, is investigated
In this paper, a model of the propagation delays in the interconnection lines on GaAs-based very hig...
A new method is presented for the analysis of interconnections on high-speed LSI/VLSI chips. Interco...
The frequency-dependent characteristics of lossy interconnections such as on-chip metallization and ...
A method of modeling first-level metal interconnect signal transmission on silicon substrates with a...
Systematic techniques for the extraction of SPICE equivalent circuits of high-speed differential in...
The transient simulation of electrically-long low-loss multiconductor interconnects is considered fr...
185 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.The advent of fast devices an...
This thesis addresses modeling and simulation of high speed interconnects. Both a full transmission ...
This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for ...
Actual interconnects are analysed and simulated by means of equivalent Spice-like circuits account...
Abstract — Nowaday, Spice is widely used for cir-cuit designs and simulations of ICs. Therefore, it ...
Signal integrity and crosstalk are issues of paramount importance in the design of high speed printe...
Simulation of delay and cross-talk in VLSI interconnects is becoming important in high speed systems...
Abstract—This paper addresses the modeling of differential drivers and receivers for the analog simu...
The problem of accurate and efficient calculation of transient signal waveforms microelectronic circ...
In this paper, a model of the propagation delays in the interconnection lines on GaAs-based very hig...
A new method is presented for the analysis of interconnections on high-speed LSI/VLSI chips. Interco...
The frequency-dependent characteristics of lossy interconnections such as on-chip metallization and ...
A method of modeling first-level metal interconnect signal transmission on silicon substrates with a...
Systematic techniques for the extraction of SPICE equivalent circuits of high-speed differential in...
The transient simulation of electrically-long low-loss multiconductor interconnects is considered fr...
185 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.The advent of fast devices an...
This thesis addresses modeling and simulation of high speed interconnects. Both a full transmission ...
This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for ...
Actual interconnects are analysed and simulated by means of equivalent Spice-like circuits account...
Abstract — Nowaday, Spice is widely used for cir-cuit designs and simulations of ICs. Therefore, it ...
Signal integrity and crosstalk are issues of paramount importance in the design of high speed printe...
Simulation of delay and cross-talk in VLSI interconnects is becoming important in high speed systems...
Abstract—This paper addresses the modeling of differential drivers and receivers for the analog simu...
The problem of accurate and efficient calculation of transient signal waveforms microelectronic circ...
In this paper, a model of the propagation delays in the interconnection lines on GaAs-based very hig...
A new method is presented for the analysis of interconnections on high-speed LSI/VLSI chips. Interco...
The frequency-dependent characteristics of lossy interconnections such as on-chip metallization and ...