In this report, a novel fabrication method, based on casting Field's metal inside dielectric molds made via fused deposition modeling, is presented. Fused deposition modeling (FDM) has become one of the most common rapid prototyping methods. Whilst it generally produces good quality mechanical structures in thermoplastics, few reliable methods have been demonstrated that produce good quality 3D electrically conductive structures. By using Field's metal to transform dielectric molds into conductive structures, nearly any continuous metal geometry buried within the polymer can be created, allowing for the realization of complex 3D architectures. A wide range of thermoplastic materials used in fused deposition modeling have been investigated, ...
Fused deposition modeling (FDM) uses computer-aided design to direct a 3D printer to build successfu...
This paper presents all-dielectric materials used to 3D print coupons with spatially varying dielec...
AbstractShorter production cycles and development times for molded interconnect devices (MID) result...
In this report, a novel fabrication method, based on casting Field's metal inside dielectric molds m...
In this report, a novel fabrication method, based on casting Field's metal inside dielectric molds m...
The 3 dimensional printing (3DP), called to additive manufacturing (AM) or rapid prototyping (RP), i...
The 3 dimensional printing (3DP), called to additive manufacturing (AM) or rapid prototyping (RP), i...
Additive manufacturing of complex structures with spatially varying electromagnetic properties can e...
Additive manufacturing of complex structures with spatially varying electromagnetic properties can e...
Fused deposition modeling (FDM) is a three-dimensional (3D) printing technology that is usually perf...
Fused Deposition Modeling (FDM) 3D printing is an additive manufacturing technique used to fabricate...
We present an integrated additive manufacturing approach for the rapid prototyping of objects with e...
Mirotznik, Mark S.The ability to fabricate electromagnetic (EM) materials with graded dielectric pro...
This paper describes a curved-layer additive manufacturing technology that has the potential to prin...
This work aims to evaluate the possibility of fabricating conductive paths for printed circuit board...
Fused deposition modeling (FDM) uses computer-aided design to direct a 3D printer to build successfu...
This paper presents all-dielectric materials used to 3D print coupons with spatially varying dielec...
AbstractShorter production cycles and development times for molded interconnect devices (MID) result...
In this report, a novel fabrication method, based on casting Field's metal inside dielectric molds m...
In this report, a novel fabrication method, based on casting Field's metal inside dielectric molds m...
The 3 dimensional printing (3DP), called to additive manufacturing (AM) or rapid prototyping (RP), i...
The 3 dimensional printing (3DP), called to additive manufacturing (AM) or rapid prototyping (RP), i...
Additive manufacturing of complex structures with spatially varying electromagnetic properties can e...
Additive manufacturing of complex structures with spatially varying electromagnetic properties can e...
Fused deposition modeling (FDM) is a three-dimensional (3D) printing technology that is usually perf...
Fused Deposition Modeling (FDM) 3D printing is an additive manufacturing technique used to fabricate...
We present an integrated additive manufacturing approach for the rapid prototyping of objects with e...
Mirotznik, Mark S.The ability to fabricate electromagnetic (EM) materials with graded dielectric pro...
This paper describes a curved-layer additive manufacturing technology that has the potential to prin...
This work aims to evaluate the possibility of fabricating conductive paths for printed circuit board...
Fused deposition modeling (FDM) uses computer-aided design to direct a 3D printer to build successfu...
This paper presents all-dielectric materials used to 3D print coupons with spatially varying dielec...
AbstractShorter production cycles and development times for molded interconnect devices (MID) result...