Properties verification of improved lead-free solder alloys

This article presents research focused on the reliability of soldered joints. The quality of solder joints is formed already during the soldering process. The first parameter that determines the quality of the connection is solderability. Good solderability is essential for the subsequent reliability of the joint. The second parameter, which affects reliability and is also determined during the soldering process, is the thickness of intermetallic compounds. However, this parameter is also affected by the operating conditions. It increases over time. These two parameters were selected for our experiment. The object of the experiment is to compare the standard lead-free solder alloy SAC 305 with solders that have been enriched with cobalt or germanium. The comparison and full results from measurement will be discussed in the full paper.This article presents research focused on the reliability of soldered joints. The quality of solder joints is formed already during the soldering process. The first parameter that determines the quality of the connection is solderability. Good solderability is essential for the subsequent reliability of the joint. The second parameter, which affects reliability and is also determined during the soldering process, is the thickness of intermetallic compounds. However, this parameter is also affected by the operating conditions. It increases over time. These two parameters were selected for our experiment. The object of the experiment is to compare the standard lead-free solder alloy SAC 305 with solders that have been enriched with cobalt or germanium. The comparison and full results from measurement will be discussed in the full paper