Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon

This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles.This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles