The use of a Zn/Ag–Cu–Zn/Zn multi-interlayer was observed to avoid the formation of Mg–Al binary intermetallic compounds (IMCs), which cause embrittlement and low strength of bonding when dissimilar metals such as Mg/Al are joined using ultrasound-assisted transient liquid phase bonding (U-TLP). The change in the microstructure and mechanical properties of the AZ31B/LY12 joints at 410, 440, and 460 °C with prolonging ultrasonic treatment (UST) time was investigated. The results showed that the diffusion of Ag and Cu was faster into the brazing seam on the LY12 side than that on the AZ31B side with increasing UST and temperature. The IMCs on both sides of the joints were transformed with the diffusion of Ag and Cu. The transformation made th...
The work deals with the fabrication of a joint between AZ31 magnesium alloy and AW-6060 aluminium al...
The ultrasonic-assisted soldering joint of Cu/Al with different contents of copper particles added t...
Ultrasound-promoted transient liquid phase bonding (U-TLP) is a high quality, high efficiency, and l...
Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) af...
Zn-5Al eutectic alloy is a promising Pb-free solder suitable for high-temperature electronics packag...
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu ...
Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) usi...
YesIn this research work, the transient liquid phase (TLP) bonding process was utilized to fabricate...
Abstract: The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magn...
A joint obtained at relatively low temperatures and serving under high temperatures has been a longs...
NoTransient liquid phase (TLP) brazing of Mg–AZ31 alloy and Ti–6Al–4V alloy was performed using doub...
The effect of Cu coating metallic interlayer on the weldability, joint strength, and interfacial mic...
In this study, solid state joining technology of friction stir welding (FSW) was carried out for Al ...
The effects of high strain-rate deformation on the phase stability and interdiffusion were investiga...
The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6...
The work deals with the fabrication of a joint between AZ31 magnesium alloy and AW-6060 aluminium al...
The ultrasonic-assisted soldering joint of Cu/Al with different contents of copper particles added t...
Ultrasound-promoted transient liquid phase bonding (U-TLP) is a high quality, high efficiency, and l...
Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) af...
Zn-5Al eutectic alloy is a promising Pb-free solder suitable for high-temperature electronics packag...
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu ...
Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) usi...
YesIn this research work, the transient liquid phase (TLP) bonding process was utilized to fabricate...
Abstract: The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magn...
A joint obtained at relatively low temperatures and serving under high temperatures has been a longs...
NoTransient liquid phase (TLP) brazing of Mg–AZ31 alloy and Ti–6Al–4V alloy was performed using doub...
The effect of Cu coating metallic interlayer on the weldability, joint strength, and interfacial mic...
In this study, solid state joining technology of friction stir welding (FSW) was carried out for Al ...
The effects of high strain-rate deformation on the phase stability and interdiffusion were investiga...
The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6...
The work deals with the fabrication of a joint between AZ31 magnesium alloy and AW-6060 aluminium al...
The ultrasonic-assisted soldering joint of Cu/Al with different contents of copper particles added t...
Ultrasound-promoted transient liquid phase bonding (U-TLP) is a high quality, high efficiency, and l...