The influence of fin-line-edge roughness (fin-LER) and gate-LER on multiple-gate (MG) tunnel field-effect transistors (TFETs) has been investigated compared with MG MOSFETs by using full three-dimensional technology computer-aided design (TCAD) simulation. From simulation results, two interesting results have been observed. First, MG TFETs show much less severe gate-LER than MG MOSFETs, which means that only fin-LER can be considered when evaluating the total LER of MG TFETs. Second, TFETs show similar to 3x more LER improvement than MOSFETs when their structures are changed from double-gate (DG) to triple-gate (TG) ones. Our findings provide the useful design guidelines of variation-tolerant TFETs. (C) 2017 The Japan Society of Applied Phy...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
Intrinsic parameter fluctuations introduced by process variations, such as line edge roughness (LER)...
In this paper, the impact of important geometrical parameters such as source and drain thickness, fi...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
The impact of line-edge roughness (LER) on double-gate (DG) Schottky-barrier field-effect transistor...
Impacts of parameter variations on the performance of double-gate (DG) tunneling FET (TFET) and conv...
In this work, the effects of line edge roughness (LER) of nanometer scale gate pattern, 3 sigma stan...
ABSTRACT Device level variability in silicon double gate lateral Tunnel Field Effect Transistors (TF...
As the conventional metal oxide semiconductor field-effect transistor (MOSFET) keep scaling down to ...
The effects of drain bias on the statistical variation of double-gate (DG) tunnel field-effect trans...
Abstract: Since, Dual Metal Gate (DMG) technology alone is not enough to rectify the problem of low ...
In this paper, we analyze the variability of III-V homojunction tunnel FET (TFET) and FinFET devices...
We examined the effects of device parameters on the transfer characteristics of triple-gate fin fiel...
A Tn Gated Fin Field Effect Transistor is on of the many novel devices that may be replacing planar ...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
Intrinsic parameter fluctuations introduced by process variations, such as line edge roughness (LER)...
In this paper, the impact of important geometrical parameters such as source and drain thickness, fi...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
The impact of line-edge roughness (LER) on double-gate (DG) Schottky-barrier field-effect transistor...
Impacts of parameter variations on the performance of double-gate (DG) tunneling FET (TFET) and conv...
In this work, the effects of line edge roughness (LER) of nanometer scale gate pattern, 3 sigma stan...
ABSTRACT Device level variability in silicon double gate lateral Tunnel Field Effect Transistors (TF...
As the conventional metal oxide semiconductor field-effect transistor (MOSFET) keep scaling down to ...
The effects of drain bias on the statistical variation of double-gate (DG) tunnel field-effect trans...
Abstract: Since, Dual Metal Gate (DMG) technology alone is not enough to rectify the problem of low ...
In this paper, we analyze the variability of III-V homojunction tunnel FET (TFET) and FinFET devices...
We examined the effects of device parameters on the transfer characteristics of triple-gate fin fiel...
A Tn Gated Fin Field Effect Transistor is on of the many novel devices that may be replacing planar ...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
Intrinsic parameter fluctuations introduced by process variations, such as line edge roughness (LER)...
In this paper, the impact of important geometrical parameters such as source and drain thickness, fi...