In the present paper, the influence of different wet pretreatment routes on the final quality of electroless layers plated on stereolithography resins is investigated. Two pretreatment methods, acidic and alkaline, are employed. Acidic etching is unable to provide acceptable results in terms of surface quality. On the contrary, alkaline etching guarantees a bright copper surface coupled with a level of adhesion high enough to pass a standard peel test. ATR FT-IR is employed to investigate the chemical reactions occurring on the resins during the pretreatment, evidencing a major role of the ester hydrolysis process on the depolymerization of the material and on the formation of new functional groups on the surface. Resin hydrolysi...
Metallic coatings, such as copper films can be easily deposited on semiconductor materials like sili...
Purpose – The adhesion between electroless copper and a substrate is one of the most important facto...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
In the present paper, the influence of different wet pretreatment routes on the final quality of e...
The use of StereoLithography (SL) can produce accurate prototype models with complex internal and e...
In the present paper the electroless metallization of 3D printed parts using stereolithography is in...
The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited co...
Stereolithography (SL) and 3D Printing (3DP) are useful technologies for three-dimensional prototyp...
Plastic components are plated with metal layers of up to one hundred microns thickness by autocataly...
The rapid evolution of microelectronics industry translates itself into a need for higher density su...
In the present paper the electroless metallization of 3D printed devices using stereolithography is ...
Selective Laser Melting process represents an interesting opportunity in the biomedical field to fab...
Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated...
In many cases of product development there is a need for a prototype looking like the subsequently m...
The introduction of amine groups on the surface of dielectric resins improves the adhesion with elec...
Metallic coatings, such as copper films can be easily deposited on semiconductor materials like sili...
Purpose – The adhesion between electroless copper and a substrate is one of the most important facto...
The effects of the different surface modification methods on the adhesion of electroless and sputter...
In the present paper, the influence of different wet pretreatment routes on the final quality of e...
The use of StereoLithography (SL) can produce accurate prototype models with complex internal and e...
In the present paper the electroless metallization of 3D printed parts using stereolithography is in...
The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited co...
Stereolithography (SL) and 3D Printing (3DP) are useful technologies for three-dimensional prototyp...
Plastic components are plated with metal layers of up to one hundred microns thickness by autocataly...
The rapid evolution of microelectronics industry translates itself into a need for higher density su...
In the present paper the electroless metallization of 3D printed devices using stereolithography is ...
Selective Laser Melting process represents an interesting opportunity in the biomedical field to fab...
Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated...
In many cases of product development there is a need for a prototype looking like the subsequently m...
The introduction of amine groups on the surface of dielectric resins improves the adhesion with elec...
Metallic coatings, such as copper films can be easily deposited on semiconductor materials like sili...
Purpose – The adhesion between electroless copper and a substrate is one of the most important facto...
The effects of the different surface modification methods on the adhesion of electroless and sputter...