A conventional flatbed scanner equipped with an additional diffusor is used as a means for rapid measurements of an important figure of merit for optical surfaces, the effective reflectance of devices such as solar cells. The application of the technique to multicrystalline silicon wafers with light trapping structures obtained by electrochemical etching is shown. The use of this method for rapid quality control in production environments as well as in the lab is envisaged Even with a non optimized diffusor, a spatial resolution of 0.1x0.1 mm2 can be achieved, with an accuracy of the reflectivity measurements of the order of 1 and data acquisition times around 10 s per wafe
This paper describes a freeware program that computes the optical losses associated with the front s...
Abstract. A new method is presented for the measurement df surface roughness in the range R. ~ 0·05-...
Reproducible, quantitative, and rapid surface roughness measurements would be valuable in many aspec...
AbstractA new method for nondestructive testing of the optical properties of various materials (semi...
The reflectance spectrum of a wafer/solar cell is used to measure physical parameters of the wafer a...
A new method for nondestructive testing of the optical properties of various materials (semiconducto...
This thesis presents a technique of attaining high-accuracy, non-contact film thickness measurements...
We present a low-cost, high-speed, high-accuracy in situ thin film measurement system for real-time ...
A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces is...
A new surface profilometry technique is proposed for profiling a wafer surface with both diffuse and...
Stacks of dielectric thin films are widely used for passivated emitter and rear solar cells based on...
The principle of free carrier absorption in combination with a CCD camera sensitive in the infrared ...
This paper discusses surface texturization of monocrystalline silicon wafer by using a very simple ...
AbstractThe reflectance of solar selective coating, covering UV to MIR bands, is measured by only on...
The paper presents the results of the development of the method and means of photostimulated scannin...
This paper describes a freeware program that computes the optical losses associated with the front s...
Abstract. A new method is presented for the measurement df surface roughness in the range R. ~ 0·05-...
Reproducible, quantitative, and rapid surface roughness measurements would be valuable in many aspec...
AbstractA new method for nondestructive testing of the optical properties of various materials (semi...
The reflectance spectrum of a wafer/solar cell is used to measure physical parameters of the wafer a...
A new method for nondestructive testing of the optical properties of various materials (semiconducto...
This thesis presents a technique of attaining high-accuracy, non-contact film thickness measurements...
We present a low-cost, high-speed, high-accuracy in situ thin film measurement system for real-time ...
A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces is...
A new surface profilometry technique is proposed for profiling a wafer surface with both diffuse and...
Stacks of dielectric thin films are widely used for passivated emitter and rear solar cells based on...
The principle of free carrier absorption in combination with a CCD camera sensitive in the infrared ...
This paper discusses surface texturization of monocrystalline silicon wafer by using a very simple ...
AbstractThe reflectance of solar selective coating, covering UV to MIR bands, is measured by only on...
The paper presents the results of the development of the method and means of photostimulated scannin...
This paper describes a freeware program that computes the optical losses associated with the front s...
Abstract. A new method is presented for the measurement df surface roughness in the range R. ~ 0·05-...
Reproducible, quantitative, and rapid surface roughness measurements would be valuable in many aspec...