Thick Al x Ga 1 x N epilayer with microcracks grown by metalorganic vapor phase epitaxy on a GaN buffer above a 0001 sapphire substrate was comprehensively characterized by spatially and spectrally resolved cathodoluminescence CL and micro Raman spectroscopy. The variation of the CL line shift and the micro Raman measurements between the cracks are consistent with the interpretation that AlGaN is to a large extent stressed like a two dimensiional film between the microcracks with nearly full relaxation close to the cracks. A satisfactory theoretical confirmation of the stress distribution was obtained by a three dimensional finite element application of the elasticity theor
We introduce a temperature dependent anisotropic model for the stresses in gallium nitride (GaN) and...
We studied the residual strain in hexagonal GaN epitaxial layers grown exactly or slightly off the (...
The evolution of stress in gallium nitride films on sapphire has been measured in real- time during ...
This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging...
This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging...
This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging...
The effect of high-temperature annealing on stress in AlxGa1-xN in different ambients and at differe...
The stress states in unintentionally doped GaN epilayers grown on Si(111), 6H-SiC(0001), and c-plane...
International audienceThe stress distribution on crack free thick continuous GaN film (12 mu m) grow...
The authors have directly measured the stress evolution during metal organic chemical vapor depositi...
500nm AlGaN thick layer with AlGaN/GaN MQW interlayer was grown on sapphire substrate for UV detecto...
This work presents a systematic study of stress and strain of AlxGa1−xN/AlN with composition ranging...
In this article we have studied the existence of stress and strain in a Si-doped GaN (2µm)/sapphire ...
Typical failures in microelectronics range from misalignments, non-uniform filling, delamination, mi...
Typical failures in microelectronics range from misalignments, non-uniform filling, delamination, mi...
We introduce a temperature dependent anisotropic model for the stresses in gallium nitride (GaN) and...
We studied the residual strain in hexagonal GaN epitaxial layers grown exactly or slightly off the (...
The evolution of stress in gallium nitride films on sapphire has been measured in real- time during ...
This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging...
This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging...
This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging...
The effect of high-temperature annealing on stress in AlxGa1-xN in different ambients and at differe...
The stress states in unintentionally doped GaN epilayers grown on Si(111), 6H-SiC(0001), and c-plane...
International audienceThe stress distribution on crack free thick continuous GaN film (12 mu m) grow...
The authors have directly measured the stress evolution during metal organic chemical vapor depositi...
500nm AlGaN thick layer with AlGaN/GaN MQW interlayer was grown on sapphire substrate for UV detecto...
This work presents a systematic study of stress and strain of AlxGa1−xN/AlN with composition ranging...
In this article we have studied the existence of stress and strain in a Si-doped GaN (2µm)/sapphire ...
Typical failures in microelectronics range from misalignments, non-uniform filling, delamination, mi...
Typical failures in microelectronics range from misalignments, non-uniform filling, delamination, mi...
We introduce a temperature dependent anisotropic model for the stresses in gallium nitride (GaN) and...
We studied the residual strain in hexagonal GaN epitaxial layers grown exactly or slightly off the (...
The evolution of stress in gallium nitride films on sapphire has been measured in real- time during ...