The on resistance increment observed when the device is operated at high drain-source voltages is one the topics that limits the performance of the AlGaN/GaN HEMT devices. In this paper, the physical mechanisms responsible of the RDSon degradation are investigated. The dynamic RDSon transient method is used in order to get insight to characterize the traps states. By calculating the Arrhenius plot associated with the RDSon transients an activation energy of 0.86eV was extracted, that can be correlated to the traps due to the incorporation of Carbon inside the buffer. This hypothesis was further supported by the analyses performed on a simpler structure (TLM). By applying a negative substrate bias the effect of only the buffer traps was stud...
Traps are characterized in AlGaN–GaN HEMTs by means of DLTS techniques and the associated charge/dis...
At the current stage of GaN technology development, AlGaN-GaN HEMTs must demonstrate adequate electr...
RON degradation due to stress in GaN-based power devices is a critical issue that limits, among othe...
The on resistance increment observed when the device is operated at high drain-source voltages is on...
Traps are identified in AlGaN-GaN HEMTs by means of different characterization techniques and the as...
Dynamic Ron dispersion due to buffer traps is a well-known issue of GaN power high electron mobility...
In this paper, we present simulation results that reproduce stress and recovery experiments in Carbo...
Traps are characterized in AlGaN-GaN HEMTs by means of DLTS techniques and the associated charge/dis...
This paper presents results concerning the dynamic performance and reliability of Fe-doped and C-dop...
This paper presents results concerning the dynamic performance and reliability of Fe-doped and C-dop...
The aim of this work is to quantitatively investigate the influence of buffer doping on the current ...
© 2016 IEEE. In this letter, we identified a dominant buffer trapping causing a bias-dependent dynam...
This paper presents an extensive investigation of the properties of the trap with activation energy ...
This paper studies the impact of C-doped GaN buffers on the dynamic performance and reliability of I...
This paper presents an extensive investigation of the properties of the trap with activation energy ...
Traps are characterized in AlGaN–GaN HEMTs by means of DLTS techniques and the associated charge/dis...
At the current stage of GaN technology development, AlGaN-GaN HEMTs must demonstrate adequate electr...
RON degradation due to stress in GaN-based power devices is a critical issue that limits, among othe...
The on resistance increment observed when the device is operated at high drain-source voltages is on...
Traps are identified in AlGaN-GaN HEMTs by means of different characterization techniques and the as...
Dynamic Ron dispersion due to buffer traps is a well-known issue of GaN power high electron mobility...
In this paper, we present simulation results that reproduce stress and recovery experiments in Carbo...
Traps are characterized in AlGaN-GaN HEMTs by means of DLTS techniques and the associated charge/dis...
This paper presents results concerning the dynamic performance and reliability of Fe-doped and C-dop...
This paper presents results concerning the dynamic performance and reliability of Fe-doped and C-dop...
The aim of this work is to quantitatively investigate the influence of buffer doping on the current ...
© 2016 IEEE. In this letter, we identified a dominant buffer trapping causing a bias-dependent dynam...
This paper presents an extensive investigation of the properties of the trap with activation energy ...
This paper studies the impact of C-doped GaN buffers on the dynamic performance and reliability of I...
This paper presents an extensive investigation of the properties of the trap with activation energy ...
Traps are characterized in AlGaN–GaN HEMTs by means of DLTS techniques and the associated charge/dis...
At the current stage of GaN technology development, AlGaN-GaN HEMTs must demonstrate adequate electr...
RON degradation due to stress in GaN-based power devices is a critical issue that limits, among othe...