The drilling of copper using a dual-pulse femtosecond laser with wavelength of 800 nm, pulse duration of 120 fs and a variable pulse separation time (0.1–150 ps) is investigated theoretically. A one-dimensional two-temperature model with temperature-dependent material properties is considered, including dynamic optical properties and the thermal-physical properties. Rapid phase change and phase explosion models are incorporated to simulate the material ablation process. Numerical results show that under the same total laser fluence of 4 J/cm2, a dual-pulse femtosecond laser with a pulse separation time of 30–150 ps can increase the ablation depth, compared to the single pulse. The optimum pulse separation time is 85 ps. It is also demonstra...
Aluminum foils with thickness ranging from 1.5 to 50 \u3bcm, and W, Mo, Ti, Cu, Fe, Ag, Au, and Pb f...
We have investigated ultrashort laser micromachining of metals, both from the point of view of the b...
We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit boa...
Ablation of copper using multipulse femtosecond laser irradiation with an 800 nm wavelength and 120-...
Ablation of copper using multipulse femtosecond laser irradiation with an 800 nm wavelength and 900-...
The influence of pulse duration on the laser drilling of metals at repetition rates of up to 1 MHz a...
Femtosecond ablation of both absorbing and transparent materials has several distinct advantages: th...
Temporally shaped femtosecond laser machining is a flexible and effective method to improve the effi...
Copper targets are irradiated in the ablation regime by pairs of equal, time-delayed collinear laser...
The use of femtosecond lasers allows materials processing of practically any material with extremely...
In this paper, a dual-beam laser micromachining system consisting of a femtosecond (fs) laser and a ...
The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated...
Investigations on the ablation of steel and copper with femtosecond laser pulses using single pulses...
In the last few years, commercially available ultrashort pulsed (usp) laser systems have reached ave...
The purpose of the present study was to investigate the energy transport through target materials ir...
Aluminum foils with thickness ranging from 1.5 to 50 \u3bcm, and W, Mo, Ti, Cu, Fe, Ag, Au, and Pb f...
We have investigated ultrashort laser micromachining of metals, both from the point of view of the b...
We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit boa...
Ablation of copper using multipulse femtosecond laser irradiation with an 800 nm wavelength and 120-...
Ablation of copper using multipulse femtosecond laser irradiation with an 800 nm wavelength and 900-...
The influence of pulse duration on the laser drilling of metals at repetition rates of up to 1 MHz a...
Femtosecond ablation of both absorbing and transparent materials has several distinct advantages: th...
Temporally shaped femtosecond laser machining is a flexible and effective method to improve the effi...
Copper targets are irradiated in the ablation regime by pairs of equal, time-delayed collinear laser...
The use of femtosecond lasers allows materials processing of practically any material with extremely...
In this paper, a dual-beam laser micromachining system consisting of a femtosecond (fs) laser and a ...
The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated...
Investigations on the ablation of steel and copper with femtosecond laser pulses using single pulses...
In the last few years, commercially available ultrashort pulsed (usp) laser systems have reached ave...
The purpose of the present study was to investigate the energy transport through target materials ir...
Aluminum foils with thickness ranging from 1.5 to 50 \u3bcm, and W, Mo, Ti, Cu, Fe, Ag, Au, and Pb f...
We have investigated ultrashort laser micromachining of metals, both from the point of view of the b...
We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit boa...