Some Issues in Liquid Metals Research

The ten articles [1–10] included in this Special Issue on “Liquid Metals” do not intend to comprehensively cover this extensive field, but, rather, to highlight recent discoveries that have greatly broadened the scope of technological applications of these materials. Improvements in understanding the physics of liquid metals are, to a large extent, due to the powerful theoretical tools in the hands of scientists, either semi-empirical [1,5,6] or ab initio (molecular dynamics, see [7]). Surface tension and wetting at metal/ceramic interfaces is an everlasting field of fundamental research with important technological implications. The review of [2] is broad enough, as the work carried out at Grenoble covers almost all interesting matters in the field. Some issues of interest in geophysics and astrophysics are discussed in [3]. The recently discovered liquid–liquid transition in several metals is dealt with in [4]. The fifth contribution [5] discusses the role of icosahedral superclusters in crystallization. In [6], thermodynamic calculations are carried out to identify the regions of the ternary phase diagram of Al-Cu-Y, where the formation of amorphous alloys is most probable. Experimental data and ab initio calculations are presented in [7] to show that an optimal microstructure is obtained if Mg is added to the Al-Si melt before than the modifier AlP alloy. Shock-induced melting of metals by means of laser driven compression is discussed in [8]. With respect to recent discoveries, one of the most outstanding developments is that of gallium alloys that are liquid at room temperature [9], and that, due to the oxide layer that readily cover their surface, maintain some “stiffness”. This has opened the possibility of 3D printing with liquid metals. The last article in this Special Issue [10] describes nano-liquid metals, a suspension of liquid metal and its alloy containing nanometer-sized particles. A room-temperature nano-liquid metal and its alloys were first introduced in the area of cooling high heat flux devices, which now is a commercial reality. However, their applications are not only in chip cooling, and can also be extended to waste heat recovery, kinetic energy harvesting, thermal interface material, etc. This is mainly due to properties such as low melting point, high thermal and electrical conductivity, as well as other additional physical or chemical properties. These articles are summarized in more detail hereafter [...