Thermal interface (Kapitza) resistance expresses how hard it is for heat to flow across material junctions inside multilayer structures. This quantity plays a crucial role in the thermal performance of nanoscale devices but is still poorly understood. Here we show that conventional Fourier-based metrology overestimates metal/semiconductor resistances by up to threefold due to misinterpretation of ballistic heat flow modes. We achieve improved identification and a different physical insight with a truncated Lévy formalism. This approach properly distinguishes interfacial dynamics from nearby quasiballistic heat flow suppression in the semiconductor. Unlike conventionally extracted values, interface resistances obtained with our new approach ...
International audienceNearly all experimental observations of quasi-ballistic heat flow are interpre...
Control and modelling of thermal transport at the nanoscale has emerged either as a key issue in mod...
Recent experiments suggest that the interfacial thermal conductance of transfer printed metal-diele...
Thermal interface (Kapitza) resistance expresses how hard it is for heat to flow across material jun...
International audienceThe existence of a universal interfacial thermal resistance in a broad range o...
Nanoscale solid-solid contact defines a wealth of materials behaviour from the friction in micro- an...
We critically readdress the definition of thermal boundary resistance at an interface between two se...
International audienceWe present a fabrication process of low-cost superlattices and simulations rel...
Understanding heat transport on nanoscale dimensions is important for fundamental advances in nanosc...
All interfaces offer resistance to heat transport. As the size of a device or structure approaches n...
Feser, Joseph P.Understanding heat transport at nanometer and sub-nanometer lengthscales is critical...
International audiencePump-probe time-domain thermoreflectance is commonly used for thermal characte...
A comprehensive description of how heat and temperature evolve on nanometer to submicron length-scal...
With the progress of nanotechnologies for microelectronic and thermoelectric devices, a lack of unde...
International audienceIn the ballistic regime of transport, we derive the thermal resistance of meta...
International audienceNearly all experimental observations of quasi-ballistic heat flow are interpre...
Control and modelling of thermal transport at the nanoscale has emerged either as a key issue in mod...
Recent experiments suggest that the interfacial thermal conductance of transfer printed metal-diele...
Thermal interface (Kapitza) resistance expresses how hard it is for heat to flow across material jun...
International audienceThe existence of a universal interfacial thermal resistance in a broad range o...
Nanoscale solid-solid contact defines a wealth of materials behaviour from the friction in micro- an...
We critically readdress the definition of thermal boundary resistance at an interface between two se...
International audienceWe present a fabrication process of low-cost superlattices and simulations rel...
Understanding heat transport on nanoscale dimensions is important for fundamental advances in nanosc...
All interfaces offer resistance to heat transport. As the size of a device or structure approaches n...
Feser, Joseph P.Understanding heat transport at nanometer and sub-nanometer lengthscales is critical...
International audiencePump-probe time-domain thermoreflectance is commonly used for thermal characte...
A comprehensive description of how heat and temperature evolve on nanometer to submicron length-scal...
With the progress of nanotechnologies for microelectronic and thermoelectric devices, a lack of unde...
International audienceIn the ballistic regime of transport, we derive the thermal resistance of meta...
International audienceNearly all experimental observations of quasi-ballistic heat flow are interpre...
Control and modelling of thermal transport at the nanoscale has emerged either as a key issue in mod...
Recent experiments suggest that the interfacial thermal conductance of transfer printed metal-diele...