We have studied the electrically induced off-plane surface displacement on two microelectronic devices using scanning Joule expansion microscopy (SJEM). We present the experimental method and surface displacement results. We show that they can be successfully compared with surface displacement images obtained using an optical interferometry method. We also present thermal images using scanning thermal microscopy (SThM) technique to underline that SJEM is more adapted to higher frequency measurements. The performances of the three methods are compared.Conception, fabrication et EXploration d'un TRAnsistor nanométrique sur un SOI avec un Diélectrique Alternatif contraint à forte conductivité thermiqu
Electrical generation of heat in single-walled carbon nanotubes (SWNTs) and subsequent thermal trans...
National audienceWe have studied temperature variations on two submicrometric dissipative structures...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
Abstract- We have studied the electrically induced off-plane surface displacement on two microelectr...
High temperatures and excessive heat generation cause degradation and malfunction of microelectronic...
An analytical model, validated by experiments and finite element simulations, is developed to study ...
International audienceControl of filament growth within conductive bridge random access memories (CB...
This thesis presents the development of a quantitative nanometer-scale thermal metrology technique, ...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
We present an imaging system that enables the extraction of three different types of information: Fi...
We present an imaging technique to measure static surface displacements of electronic components. A ...
The miniaturisation of integrated circuits causes higher power-densities. The interconnection joinin...
Electrical generation of heat in single-walled carbon nanotubes (SWNTs) and subsequent thermal trans...
National audienceWe have studied temperature variations on two submicrometric dissipative structures...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
Abstract- We have studied the electrically induced off-plane surface displacement on two microelectr...
High temperatures and excessive heat generation cause degradation and malfunction of microelectronic...
An analytical model, validated by experiments and finite element simulations, is developed to study ...
International audienceControl of filament growth within conductive bridge random access memories (CB...
This thesis presents the development of a quantitative nanometer-scale thermal metrology technique, ...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
We present an imaging system that enables the extraction of three different types of information: Fi...
We present an imaging technique to measure static surface displacements of electronic components. A ...
The miniaturisation of integrated circuits causes higher power-densities. The interconnection joinin...
Electrical generation of heat in single-walled carbon nanotubes (SWNTs) and subsequent thermal trans...
National audienceWe have studied temperature variations on two submicrometric dissipative structures...
With the development and application of micro/nano electronic mechanical systems (MEMS, NEMS) for a ...