The applicability of NIST-ASTM electromigration test patterns when used to test "bamboo" metal lines is discussed
Microelectronic test structures are used for wide variety of tasks which include equipment character...
In this work, the electromigration (EM) performance of electroplated damascene Cu is investigated by...
This paper describes fine-grained Mg containing A1-Si alloys, which have an electromigration resista...
The applicability of NIST-ASTM electromigration test patterns when used to test "bamboo" metal lines...
In this work the applicability of NIST electromigration test patterns when used to test “bamboo” met...
Electromigration tests have been performed on a number of test structures with different geometries ...
The presence of a different activation energy for the electromigration during the early phase of acc...
This work is aimed at proposing a standard procedure for moderately accelerated Electromigration (EM...
The design of a novel test structure to study the influence of electromigration and thermomigration ...
A complete description for early resistance change and mechanical stress evolution in near-bamboo in...
The electromigration performance of Al-1%Si/TiN/ti metal scheme is investigated both for contacts an...
An electromigration (EM) test mask was designed to utilize both standard ASTM and Standard Wafer-lev...
Normally and highly accelerated electromigration tests on Al-Cu lines of different widths are compar...
In this paper the use of High Resolution Resistometric Techniques for early detection of electromigr...
A complete description for early resistance change and mechanical stress evolution in near-bamboo in...
Microelectronic test structures are used for wide variety of tasks which include equipment character...
In this work, the electromigration (EM) performance of electroplated damascene Cu is investigated by...
This paper describes fine-grained Mg containing A1-Si alloys, which have an electromigration resista...
The applicability of NIST-ASTM electromigration test patterns when used to test "bamboo" metal lines...
In this work the applicability of NIST electromigration test patterns when used to test “bamboo” met...
Electromigration tests have been performed on a number of test structures with different geometries ...
The presence of a different activation energy for the electromigration during the early phase of acc...
This work is aimed at proposing a standard procedure for moderately accelerated Electromigration (EM...
The design of a novel test structure to study the influence of electromigration and thermomigration ...
A complete description for early resistance change and mechanical stress evolution in near-bamboo in...
The electromigration performance of Al-1%Si/TiN/ti metal scheme is investigated both for contacts an...
An electromigration (EM) test mask was designed to utilize both standard ASTM and Standard Wafer-lev...
Normally and highly accelerated electromigration tests on Al-Cu lines of different widths are compar...
In this paper the use of High Resolution Resistometric Techniques for early detection of electromigr...
A complete description for early resistance change and mechanical stress evolution in near-bamboo in...
Microelectronic test structures are used for wide variety of tasks which include equipment character...
In this work, the electromigration (EM) performance of electroplated damascene Cu is investigated by...
This paper describes fine-grained Mg containing A1-Si alloys, which have an electromigration resista...