Resistance change due to Cu transport and precipitation during electromigration in submicrometric Al-0.5%Cu lines

A. SCORZONI
I. DE MUNARI
R. BALBONI
F. TAMARRI
A. GARULLI
FANTINI, Fausto

Publication date

January 1996

Publisher

ATTUALE: Elsevier Science Limited:Oxford Fulfillment Center, PO Box 800, Kidlington Oxford OX5 1DX United Kingdom:011 44 1865 843000, 011 44 1865 843699, EMAIL: asianfo@elsevier.com, tcb@elsevier.co.UK, INTERNET: http://www.elsevier.com, http://www.elsevier.com/locate/shpsa/, Fax: 011 44 1865 843010 PRECEDENTE: Pergamon Press., Oxford

Abstract

In this work we describe the resistance changes due to Cu transport and precipitation during electromigration in 0.5 micron wide Al-0.5%Cu lines

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Resistance change due to Cu transport and precipitation during electromigration in submicrometric Al-0.5%Cu lines

Abstract

Extracted data

Resistance change due to Cu transport and precipitation during electromigration in submicrometric Al-0.5%Cu lines

Abstract

Extracted data

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