The core of the EEPROM memory cell is the tunnel oxide grown on an n(+) implant named capacitor implant which also electrically connects the cell drain. Different implant doses have been performed to optimize the cell junction characteristics in a 0.35 mum EEPROM technology. The impact on the quality and electrical characteristics of the tunnel oxide is hereafter analyzed. Furthermore, a modeling is presented, giving estimation of the oxide thickness and substrate superficial doping with a good correlation of these last values with SIMS measurements. As expected, a linear relation between the implant dose and the superficial doping has been found. (C) 2001 Elsevier Science Ltd. All rights reserved
Plasma doping (PLAD) is increasingly applied in microelectronic device manufacture to produce high t...
The pMOS-RADFET (radiation field-effect transistor) as a microdosimeter has been widely applied in s...
The effects of implantation conditions and annealing conditions on the formation of buried oxide lay...
The core of the EEPROM memory cell is the tunnel oxide grown on an n(+) implant named capacitor impl...
The floating gate EEPROM has been a popular choice for semiconductor memories for many years. In thi...
Electrically Erasable Programmable Read Only Memory (EEPROM) test structures have been studied using...
The objective of this project is to investigate the electrical characteristics of Buried Channel PMO...
Circuit simulation enters into a new stage of enhanced importance. From the conventional circuit sim...
This work presents new experimental data on ultra-low level Stress Induced Leakage Currents measured...
Non volatile memories hold 30% of the global volume of semiconductor memory market nowadays. The gen...
Programming performance of dual-bit silicon-oxide-nitride-oxide-silicon memories is studied on cells...
The microstructures of SIMOX (separation by implanted oxygen) structures implanted at 170keV with O+...
Degradation of the tunneling oxide film in EEPROM and FLASH memory test structures has been studied....
Programming performance of dual-bit silicon-oxide-nitride-oxide-silicon memories is studied on cells...
An analytical drain current model is presented for NMOSFETs with pocket implantation. An effective d...
Plasma doping (PLAD) is increasingly applied in microelectronic device manufacture to produce high t...
The pMOS-RADFET (radiation field-effect transistor) as a microdosimeter has been widely applied in s...
The effects of implantation conditions and annealing conditions on the formation of buried oxide lay...
The core of the EEPROM memory cell is the tunnel oxide grown on an n(+) implant named capacitor impl...
The floating gate EEPROM has been a popular choice for semiconductor memories for many years. In thi...
Electrically Erasable Programmable Read Only Memory (EEPROM) test structures have been studied using...
The objective of this project is to investigate the electrical characteristics of Buried Channel PMO...
Circuit simulation enters into a new stage of enhanced importance. From the conventional circuit sim...
This work presents new experimental data on ultra-low level Stress Induced Leakage Currents measured...
Non volatile memories hold 30% of the global volume of semiconductor memory market nowadays. The gen...
Programming performance of dual-bit silicon-oxide-nitride-oxide-silicon memories is studied on cells...
The microstructures of SIMOX (separation by implanted oxygen) structures implanted at 170keV with O+...
Degradation of the tunneling oxide film in EEPROM and FLASH memory test structures has been studied....
Programming performance of dual-bit silicon-oxide-nitride-oxide-silicon memories is studied on cells...
An analytical drain current model is presented for NMOSFETs with pocket implantation. An effective d...
Plasma doping (PLAD) is increasingly applied in microelectronic device manufacture to produce high t...
The pMOS-RADFET (radiation field-effect transistor) as a microdosimeter has been widely applied in s...
The effects of implantation conditions and annealing conditions on the formation of buried oxide lay...