Silicon Controlled Rectifier (SCR) devices fabricated in a SiGe BiCMOS technology are optimized for Charged Device Model (CDM) Electrostatic Discharge (ESD) protection. This optimization involves combined experimental and Technology Computer Aided Design (TCAD) ESD simulation analysis of the quasi-static current-voltage and transient response characteristics during fast stress conditions. The underlying physical mechanisms critical to the device design are demonstrated based on very fast transmission line pulsing (VFTLP) measurement and physics-based simulation results. © 2013 Elsevier Ltd. All rights reserved
As process technologies advance into deep sub-micrometer and nanometer scale, the charged device mod...
As semiconductor process continues to advance, the miniaturization of feature sizes places higher de...
116 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2009.This dissertation focuses on ...
Silicon Controlled Rectifier (SCR) devices fabricated in a SiGe BiCMOS technology are optimized for ...
Realization of on-chip electrostatic discharge (ESD) protection requires extensive technical experie...
We investigate the geometry layout and metal pattern in order to seek robust and optimized electrost...
This paper reports design and analysis of new low triggering voltage dual-polarity silicon-controlle...
This paper describes the development of a SPICE equivalent-circuit model of the silicon-controlled r...
Realization of on-chip electrostatic discharge (ESD) protection requires extensive technical experie...
This paper describes the development of a SPICE equivalent-circuit model of the silicon-controlled r...
A new silicon-controlled rectifier (SCR) fabricated in a 30-V mixed-signal CDMOS (CMOS/DMOS) technol...
Electrostatic discharge (ESD) protection for high-voltage integrated circuits is challenging due to ...
Electrostatic Discharge (ESD), an event of a sudden transfer of electrons between two bodies at diff...
Electrostatic discharge (ESD) protection design is challenging for RF integrated circuits (ICs) beca...
We report design optimization of new low-triggering dual-directional SCR (LTdSCR) ESD protection str...
As process technologies advance into deep sub-micrometer and nanometer scale, the charged device mod...
As semiconductor process continues to advance, the miniaturization of feature sizes places higher de...
116 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2009.This dissertation focuses on ...
Silicon Controlled Rectifier (SCR) devices fabricated in a SiGe BiCMOS technology are optimized for ...
Realization of on-chip electrostatic discharge (ESD) protection requires extensive technical experie...
We investigate the geometry layout and metal pattern in order to seek robust and optimized electrost...
This paper reports design and analysis of new low triggering voltage dual-polarity silicon-controlle...
This paper describes the development of a SPICE equivalent-circuit model of the silicon-controlled r...
Realization of on-chip electrostatic discharge (ESD) protection requires extensive technical experie...
This paper describes the development of a SPICE equivalent-circuit model of the silicon-controlled r...
A new silicon-controlled rectifier (SCR) fabricated in a 30-V mixed-signal CDMOS (CMOS/DMOS) technol...
Electrostatic discharge (ESD) protection for high-voltage integrated circuits is challenging due to ...
Electrostatic Discharge (ESD), an event of a sudden transfer of electrons between two bodies at diff...
Electrostatic discharge (ESD) protection design is challenging for RF integrated circuits (ICs) beca...
We report design optimization of new low-triggering dual-directional SCR (LTdSCR) ESD protection str...
As process technologies advance into deep sub-micrometer and nanometer scale, the charged device mod...
As semiconductor process continues to advance, the miniaturization of feature sizes places higher de...
116 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2009.This dissertation focuses on ...