Add to ORKGPassing voltage levels measured from the human metal model tester are correlated with the failure current levels obtained from the transmission line pulsing (TLP) tester for electrostatic discharge protection devices fabricated in 0.18-and 0.35-μm MOS technologies. Various relevant TLP parameters, including the holding voltage and on-state resistance, are accounted for in the improved correlation formula developed in this study. © 2011 IEEE
An on-wafer human metal model ESD measurement setup with voltage and current waveform measurement ca...
SI engineers usually build PCB test coupons and perform cross-sectioning and material properties ext...
International audienceIn order to ensure reliability of systems early in the design phase, it is bec...
Passing voltage levels measured from the human metal model tester are correlated with the failure cu...
Passing voltage levels measured from the human metalmodel tester are correlated with the failure cur...
Correlation factors between different ESD pulse types for different back-end-of-line (BEOL) metal-li...
Abstract — There are several models which try to describe the waveforms and damage produced by an el...
The electrical characterization of devices and circuits regarding their electrostatic discharge (ESD...
Electrostatic discharge (ESD) is responsible for more than 25% of semiconductor device and chip dama...
A new methodology for characterizing product-level failures due to the human metal model (HMM) stres...
Most electrostatic discharge (ESD) generators are built in accordance with the IEC 61000-4-2 specifi...
A new methodology for characterizing product-level failures due to the human metal model (HMM) stres...
Electrostatic discharge (ESD) generators are used for testing the robustness of electronics toward E...
International audienceA new setup for generating a Human Metal Model compliant waveform with a TLP i...
[[abstract]]Motivation of this research study is to compare the Electro Static Discharge (ESD) chara...
An on-wafer human metal model ESD measurement setup with voltage and current waveform measurement ca...
SI engineers usually build PCB test coupons and perform cross-sectioning and material properties ext...
International audienceIn order to ensure reliability of systems early in the design phase, it is bec...
Passing voltage levels measured from the human metal model tester are correlated with the failure cu...
Passing voltage levels measured from the human metalmodel tester are correlated with the failure cur...
Correlation factors between different ESD pulse types for different back-end-of-line (BEOL) metal-li...
Abstract — There are several models which try to describe the waveforms and damage produced by an el...
The electrical characterization of devices and circuits regarding their electrostatic discharge (ESD...
Electrostatic discharge (ESD) is responsible for more than 25% of semiconductor device and chip dama...
A new methodology for characterizing product-level failures due to the human metal model (HMM) stres...
Most electrostatic discharge (ESD) generators are built in accordance with the IEC 61000-4-2 specifi...
A new methodology for characterizing product-level failures due to the human metal model (HMM) stres...
Electrostatic discharge (ESD) generators are used for testing the robustness of electronics toward E...
International audienceA new setup for generating a Human Metal Model compliant waveform with a TLP i...
[[abstract]]Motivation of this research study is to compare the Electro Static Discharge (ESD) chara...
An on-wafer human metal model ESD measurement setup with voltage and current waveform measurement ca...
SI engineers usually build PCB test coupons and perform cross-sectioning and material properties ext...
International audienceIn order to ensure reliability of systems early in the design phase, it is bec...