In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to increase the throughput of the memory system currently used on line cards. The 3D bus architecture allows multiple processing elements on a line card to access a shared memory. The main advantage of the proposed architecture is to increase the network processor off-chip memory bandwidth while diminishing the latency otherwise caused by the single bus competition. ©2004 IEEE
none5Shared L1 memories are of interest for tightly-coupled processor clusters in programmable accel...
Three-Dimensional (3D) silicon integration is an emerging technology that vertically stacks multiple...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to incr...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
In this paper, we present a 3D-mesh architecture which is utilized as a processor-memory interconnec...
In this paper, we propose two off-chip interconnect architectures, called 3D-interconnects, to commu...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
As Moore’s Law slows down, new integration technologies emerge, such as 3D integration, silicon inte...
The communication and memory organization in system on chip are a major source of energy consumption...
Main-stream general-purpose microprocessors require a collection of high-performance interconnects t...
Shared L1 memories are of interest for tightlycoupled processor clusters in programmable accelerator...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
none5Shared L1 memories are of interest for tightly-coupled processor clusters in programmable accel...
Three-Dimensional (3D) silicon integration is an emerging technology that vertically stacks multiple...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to incr...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
In this paper, we present a 3D-mesh architecture which is utilized as a processor-memory interconnec...
In this paper, we propose two off-chip interconnect architectures, called 3D-interconnects, to commu...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
As Moore’s Law slows down, new integration technologies emerge, such as 3D integration, silicon inte...
The communication and memory organization in system on chip are a major source of energy consumption...
Main-stream general-purpose microprocessors require a collection of high-performance interconnects t...
Shared L1 memories are of interest for tightlycoupled processor clusters in programmable accelerator...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
none5Shared L1 memories are of interest for tightly-coupled processor clusters in programmable accel...
Three-Dimensional (3D) silicon integration is an emerging technology that vertically stacks multiple...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
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