300-306A simple quantitative model has been proposed for exploring the combined effect of size, shape, and electron scattering on the electrical resistivity of metallic nanowires. In the present model, the effect of different cross-sectional shapes of nanowires has been comprised on the surface and grain boundary scattering. For understanding electrical behavior at the nanolevel, the incorporation of specularity parameter (p) with different cross-sectional shapes of nanowires is essential. It is responsible for the reduction in the mean free path of electrons; which generates the favorable condition for enhancing the surface scattering, consequently contributing to increment of electrical resistivity. The applicability of the proposed ...
We have measured the resistances (and resistivities) of Ag and Cu nanowires of diameters ranging fro...
Increasing resistivity of metal wires with reducing nanoscale dimensions is a major performance bott...
This work addresses the resistivity increase in Cu interconnects with decreasing line width. Recent ...
A simple quantitative model has been proposed for exploring the combined effect of size, shape, and ...
It is well known that the conductivity of metal nanowires decreases with the wire diameter. This siz...
Conductivity of nanostructures differ significantly from the bulk. One such manifestation is the res...
A self-consistent analytical solution of the multi-subband Boltzmann transport equation with collisi...
Single gold nanowires with diameters ranging between 80 and 300 nm were fabricated by electrochemica...
Density functional theory and density functional tight binding are applied to model electron transpo...
Ando’s model provides a rigorous quantum mechanical framework for electron-surface roughness scatter...
The resistivity of metallic thin films and nanowires increases drastically when the film thickness o...
The resistivity of metallic thin films and nanowires increases drastically when the film thickness o...
We study the resistivity scaling in nanometer-sized metallic wires due to surface roughness and grai...
A modeling approach, based on an analytical solution of the semiclassical multi-subband Boltzmann tr...
The principal aim of this thesis is to study the electrical transport properties of metal nanowires....
We have measured the resistances (and resistivities) of Ag and Cu nanowires of diameters ranging fro...
Increasing resistivity of metal wires with reducing nanoscale dimensions is a major performance bott...
This work addresses the resistivity increase in Cu interconnects with decreasing line width. Recent ...
A simple quantitative model has been proposed for exploring the combined effect of size, shape, and ...
It is well known that the conductivity of metal nanowires decreases with the wire diameter. This siz...
Conductivity of nanostructures differ significantly from the bulk. One such manifestation is the res...
A self-consistent analytical solution of the multi-subband Boltzmann transport equation with collisi...
Single gold nanowires with diameters ranging between 80 and 300 nm were fabricated by electrochemica...
Density functional theory and density functional tight binding are applied to model electron transpo...
Ando’s model provides a rigorous quantum mechanical framework for electron-surface roughness scatter...
The resistivity of metallic thin films and nanowires increases drastically when the film thickness o...
The resistivity of metallic thin films and nanowires increases drastically when the film thickness o...
We study the resistivity scaling in nanometer-sized metallic wires due to surface roughness and grai...
A modeling approach, based on an analytical solution of the semiclassical multi-subband Boltzmann tr...
The principal aim of this thesis is to study the electrical transport properties of metal nanowires....
We have measured the resistances (and resistivities) of Ag and Cu nanowires of diameters ranging fro...
Increasing resistivity of metal wires with reducing nanoscale dimensions is a major performance bott...
This work addresses the resistivity increase in Cu interconnects with decreasing line width. Recent ...