Failure mechanisms induced by electromigration in advanced ECL ICs

Emitter Coupled Logic circuits, based on bipolar transistors are extremely fast but involve very high current densities and operating junction temperatures which may lead to circuit failure due to electromigration and interdiffusion effects. Electromigration leads both to the formation of open circuits in the Al-Cu metallizations, and to degradation of ohmic contacts due to accumulation of transported metal material