Characterization of nanostructured copper films for electromagnetic shield

Purpose – The purpose of this paper is to obtain a multidisciplinary characterization of nanostructured copper films for electromagnetic shields. Design/methodology/approach – Structural and electrical analysis have been applied, on copper nanometric films produced by a magnetron sputtering device. Findings – Data are provided for copper films realized by magnetron sputtering deposition on glass, in different operating conditions. Practical implications – A multidisciplinary comprehension of shielding effectiveness of nanostructured thin films can be important in many applications where there are electromagnetic compatibility problems. Originality/value – The paper gives a valuable set of information for the characterization of nanometric copper thin films