Application-oriented performance of RF CMOS technologies on flexible substrates
- Philippe, Justine
- Lecavelier, Aurélien
- Berthomé, Matthieu
- Robillard, J.F.
- Gaquière, Christophe
- Danneville, Francois
- Gloria, Daniel
- Raynaud, Christine
- Dubois, Emmanuel
Publication date
December 2015
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
International audienceUltimate-thinning-and-transfer-bonding (UTTB) of RF SOI-CMOS chips is demonstrated on plastic, metal and glass substrates. Beyond process simplicity, UTTB can be tailored to meet specific application requirements like ultra mechanical flexibility, heat dissipation, transparency while retaining same f(T)/f(max) performance and improving harmonic rejection when compared to conventional rigid SOI
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