The effect of the addition of oxalate to the growth of a cuprous oxide layer on copper electrodes was analysed at potential near that of the open circuit, in borax solutions (7 < pH < 9) by cyclic voltammetry, ellipsometry and surface charge techniques. The oxide formation is explained as a sequence of Cu2 O layer growth, ippl, cationic defect accumulation and Cu(II) adsorption on the oxide/solution interface, and a dissolution/precipitation step similar to the mechanism previously reported in oxalate free solutions. The oxalate adsorption at pH = 9 increases the dissolution rate and a greater thickness of the outer layer, oppl, is obtained. Nevertheless, the oxalate adsorption at pH = 7 decreases the cationic defect on the cuprous oxide/el...
A detailed study of the oxidation of Cu substrates was carried out under controlled conditions by re...
The effects of additives on copper electrodeposition processes have been investigated with electroch...
Schrader I, Wittig L, Richter K, et al. Formation and Structure of Copper(II) Oxalate Layers on Carb...
Dedicated to Professor Josef Barthel on the occasion of his 80th birthday The effect of the addition...
The influence of O₃ on the passive behaviour of copper was analysed in the potential region -0.32 to...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
Experiments on deposition of Cu2O films from basic cupper sulfate solution show that copper also dep...
The reduction of oxygen on brass type Cu77Zn21Al2 in contact with 0.1 mol L-1 borax at pH 9.2 with ...
Copper(II) oxalate was grown on carboxy-terminated self-assembled monolayers using a step-by-step ap...
Autorisation éditeur okInternational audienceThe active corrosion of ancient artefacts (bronze disea...
The corrosion resistance of Cu-Zn alloys strongly depends on the quality of the protective passive f...
The copper electrode potentials measured by the open circuit potential method in strongly aerated so...
Electropolished samples of copper were kept in contact with dry oxygen under atmospheric pressure, a...
In an ECMP process, a wafer is anodically baised during polishing. The electrical potential is the d...
A detailed study of the oxidation of Cu substrates was carried out under controlled conditions by re...
The effects of additives on copper electrodeposition processes have been investigated with electroch...
Schrader I, Wittig L, Richter K, et al. Formation and Structure of Copper(II) Oxalate Layers on Carb...
Dedicated to Professor Josef Barthel on the occasion of his 80th birthday The effect of the addition...
The influence of O₃ on the passive behaviour of copper was analysed in the potential region -0.32 to...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
The semiconducting properties of anodic passive films formed on polycrystalline copper in aqueous bo...
Experiments on deposition of Cu2O films from basic cupper sulfate solution show that copper also dep...
The reduction of oxygen on brass type Cu77Zn21Al2 in contact with 0.1 mol L-1 borax at pH 9.2 with ...
Copper(II) oxalate was grown on carboxy-terminated self-assembled monolayers using a step-by-step ap...
Autorisation éditeur okInternational audienceThe active corrosion of ancient artefacts (bronze disea...
The corrosion resistance of Cu-Zn alloys strongly depends on the quality of the protective passive f...
The copper electrode potentials measured by the open circuit potential method in strongly aerated so...
Electropolished samples of copper were kept in contact with dry oxygen under atmospheric pressure, a...
In an ECMP process, a wafer is anodically baised during polishing. The electrical potential is the d...
A detailed study of the oxidation of Cu substrates was carried out under controlled conditions by re...
The effects of additives on copper electrodeposition processes have been investigated with electroch...
Schrader I, Wittig L, Richter K, et al. Formation and Structure of Copper(II) Oxalate Layers on Carb...