An annotated guide to utilize ring-oscillators as thermal sensor in FPGA technology

© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksRing Oscillators (ROs) are established as practical thermal sensors in Field Programmable Gate Array (FPGA) devices. Despite its proven technical usefulness in low-power design and thermal aspects of integrated circuit, a detailed standard procedure is not found in the literature. In this paper we present an optimized scheme including a detailed description of all elements and considerations, so those interested can quickly incorporate these ideas. Also, we show implementation, calibration and resources performing a characterization of a Xilinx Spartan 6 deviceThis work was partially supported by the Consejo Nacional de Investigaciones Científicas y Técnicas (CONICET), UN- ´ MDP and the International Centre for Theoretical Physics ICTP Associateship Scheme, and Comunidad Autonoma de ´ Madrid (Spain) DIFRAGEOS Project S2013/ICE-300