Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

Sinter pastes for rapid and low-temperature die-attach bonding are developed to enable sintering under a nitrogen atmosphere. First, microscale brass metal pigment flakes are stirred in hydrochloric acid to selectively etch zinc from the alloy composition, creating surface modifications. A binder mixture of α-terpineol and polyethylene glycol 600 (PEG600) is used to prepare the sinter paste. The surface modifications provide accelerated material transport, leading to improved sintering capabilities even at low sintering temperatures (≤275 °C). A bulk-like sintered microstructure with