We present local global SRAM macro optimizations for 3nm FinFET and 2nm Nanosheet using Face-to-Face (F2F) and Wafer-to-Wafer (W2W) hybrid bonding at sub 1um pitch. Bonding pad parasitics are measured experimentally to calibrate RC models of the pad used to evaluate 3D-optimized memory macro delays. 3Doptimized macros are designed to reduce the macro external delay by ~50%. With customized SRAM BEOL, performance improvement of up to 70% for larger memories is observed compared with 2D macro. We also show that bit-cell tech-level optimizations have minor impact on the performance of large caches at advanced nodes due to high metal resistance in the macro global routing. Finally, at system-level we partition a L2 data memory (with 3D-optimize...
In this article, we analyzed the stability, power, performance, and area of 6T-SRAMs using a promisi...
Memories which are embedded on the same physical chip as the processor, are becoming dominant in chi...
For the first time, we suggested that the monolithic 3D (M3D) static random access memory (SRAM) wit...
Advanced CMOS SoCs with more cores and more complex memory hierarchies are hitting the memory wall, ...
In this work, we explore the resource of backside (BS) interconnect for signal routing in SRAM macro...
This paper analyzes the most feasible 3D integration and partitioning scheme for STT-MRAM based cach...
This paper describes a three- dimensional DRAM in which the floating body capacitance (FBC) of a ful...
The objective of this thesis is to optimize the uncore of 3D many-core architectures. More specifica...
In this paper, we present a power, performance, area and cost (PPAC) analysis for large-scale 3D pro...
Memory bandwidth has become a major performance bottleneck as more and more cores are integrated ont...
Abstract — This paper introduces our research status focusing on 3D-implemented microprocessors. 3D-...
In most of the electronics and communication devices such as mobile, video phone and handheld video ...
AbstractTechnology scaling is increasingly yielding diminish-ing returns in terms of product perform...
The emergence of 5G, automotive, and AI-based applications are creating new capabilities and a huge ...
session T8: TransistorInternational audienceFor the first time, we propose a 3D-monolithic SRAM arch...
In this article, we analyzed the stability, power, performance, and area of 6T-SRAMs using a promisi...
Memories which are embedded on the same physical chip as the processor, are becoming dominant in chi...
For the first time, we suggested that the monolithic 3D (M3D) static random access memory (SRAM) wit...
Advanced CMOS SoCs with more cores and more complex memory hierarchies are hitting the memory wall, ...
In this work, we explore the resource of backside (BS) interconnect for signal routing in SRAM macro...
This paper analyzes the most feasible 3D integration and partitioning scheme for STT-MRAM based cach...
This paper describes a three- dimensional DRAM in which the floating body capacitance (FBC) of a ful...
The objective of this thesis is to optimize the uncore of 3D many-core architectures. More specifica...
In this paper, we present a power, performance, area and cost (PPAC) analysis for large-scale 3D pro...
Memory bandwidth has become a major performance bottleneck as more and more cores are integrated ont...
Abstract — This paper introduces our research status focusing on 3D-implemented microprocessors. 3D-...
In most of the electronics and communication devices such as mobile, video phone and handheld video ...
AbstractTechnology scaling is increasingly yielding diminish-ing returns in terms of product perform...
The emergence of 5G, automotive, and AI-based applications are creating new capabilities and a huge ...
session T8: TransistorInternational audienceFor the first time, we propose a 3D-monolithic SRAM arch...
In this article, we analyzed the stability, power, performance, and area of 6T-SRAMs using a promisi...
Memories which are embedded on the same physical chip as the processor, are becoming dominant in chi...
For the first time, we suggested that the monolithic 3D (M3D) static random access memory (SRAM) wit...