International audienceThe extreme properties of carbon nanotubes (CNTs) make them a good candidate for advanced interconnects to achieve the performances required for the new generation of integrated circuits (ICs). However, the integration of CNTs in microelectronics devices requires the development of a technique allowing the control of the morphology of CNTs. In this paper, we report on a simple technique to vertically integrate CNTs on silicon substrate via porous alumina thin films. The process follows four steps: (i) aluminium thin films deposition on Si substrate, (ii) anodic oxidation generating an alumina template with vertical and cylindrical nanopores (/ < 40 nm), (iii) electrodeposition of metal catalyst on Si substrate at the b...