Colloque avec actes et comité de lecture. Internationale.International audienceThe major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heating induces mechanical constraints due to the various coefficients of thermal expansion of different materials. The life in fatigue, bound to the non-elastic energy dissipated during a cycle, depends strongly on the non-linear behaviour. The reliability methods are then applied here with importance sampling durind an iterative process of reponse surface fitting
Lifetime of power electronic devices, in particular those used for wind turbines, is short due to th...
Engineers use semi-empirical models of complex degradation phenomena to manage the integrity of stru...
The thermal fatigue of the bond-wire contacts at the topside interconnections of power electronic de...
The major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heatin...
International audienceThe major failure mode of power IGBT is the thermal fatigue of the solder join...
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in sol...
Printed board assemblies, i.e. components soldered on printed circuit boards (PCBs), are exposed to ...
Life-time of power electronics assemblies is limited, mainly due to the numerous thermal cycles expe...
Though, significant efforts have led to high solder joint quality, thermomechanical fatigue and dela...
In this paper, an Insulated Gate Bipolar Transistor (IGBT) module designed for aeronautic applicatio...
Abstract: The failure pattern of repairable mechanical equipment subject to deterioration phenomena...
Engineers perform fatigue assessments to support structural integrity management. Given that the pur...
In this paper, an innovative methodology for predictive reliability of intelligent power devices use...
International audienceA thermodynamically consistent cohesive zone model accounting for mixed-mode l...
Wind turbine reliability is an important issue for wind energy cost minimization, especially by redu...
Lifetime of power electronic devices, in particular those used for wind turbines, is short due to th...
Engineers use semi-empirical models of complex degradation phenomena to manage the integrity of stru...
The thermal fatigue of the bond-wire contacts at the topside interconnections of power electronic de...
The major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heatin...
International audienceThe major failure mode of power IGBT is the thermal fatigue of the solder join...
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in sol...
Printed board assemblies, i.e. components soldered on printed circuit boards (PCBs), are exposed to ...
Life-time of power electronics assemblies is limited, mainly due to the numerous thermal cycles expe...
Though, significant efforts have led to high solder joint quality, thermomechanical fatigue and dela...
In this paper, an Insulated Gate Bipolar Transistor (IGBT) module designed for aeronautic applicatio...
Abstract: The failure pattern of repairable mechanical equipment subject to deterioration phenomena...
Engineers perform fatigue assessments to support structural integrity management. Given that the pur...
In this paper, an innovative methodology for predictive reliability of intelligent power devices use...
International audienceA thermodynamically consistent cohesive zone model accounting for mixed-mode l...
Wind turbine reliability is an important issue for wind energy cost minimization, especially by redu...
Lifetime of power electronic devices, in particular those used for wind turbines, is short due to th...
Engineers use semi-empirical models of complex degradation phenomena to manage the integrity of stru...
The thermal fatigue of the bond-wire contacts at the topside interconnections of power electronic de...