This article provides a detailed discussion of 1-hexanoic-acid-stabilised copper nanoparticles with an average diameter of similar to 80 nm prepared from cupric oxide micro-powders for low-temperature sintering applications. The obtained fine particles were dispersed in dipropylene glycol using a bead mill to obtain a stable paste containing 50 wt% copper. Sintering experiments at temperatures in the range of 120-250 degrees C were performed under a nitrogen or 3%H-2-N-2 gas flow. The lowest resistivity, approximately three times that of bulk copper, was obtained at 250 degrees C. These particles exhibited good conductivity upon sintering under nitrogen only. 1-Hexanoic acid contributed to the acceleration of sintering by removing the Cu64O...
Three-dimensional integrated circuits (3D-IC) technology was introduced to solve the interconnect de...
In order to overcome the serious problems posed by Cu ink, which include the strong tendency to the ...
Sub-50 nm copper nanoparticles coated with sub-5 nm 1-octanethiol layer for oxidation inhibition wer...
Copper paste is considered as a promising candidate for printed electronics in replacement for silve...
There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for...
Power electronics demand miniaturization, integration, higher electrical and ther-mal conductivities...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...
There are two main technologies for the commercialization of printable and flexible electronic devic...
High temperature power electronics based on wide-bandgap semiconductors have prominent applications,...
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon at...
Nowadays, the demand for enhanced performance and reliability in micro and nano systems is growing, ...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
In this work a Cu paste consisting in both micro and nanoparticles was produced. The copper paste wa...
Here, the alpha amino acid l-alanine is employed as both a capping and stabilizing agent in the aque...
Nanoparticle agglomerates of passivated Fe (n-Fe) and Fe0.96Cu0.04 (n-Fe0.96Cu0.04), synthesized thr...
Three-dimensional integrated circuits (3D-IC) technology was introduced to solve the interconnect de...
In order to overcome the serious problems posed by Cu ink, which include the strong tendency to the ...
Sub-50 nm copper nanoparticles coated with sub-5 nm 1-octanethiol layer for oxidation inhibition wer...
Copper paste is considered as a promising candidate for printed electronics in replacement for silve...
There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for...
Power electronics demand miniaturization, integration, higher electrical and ther-mal conductivities...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...
There are two main technologies for the commercialization of printable and flexible electronic devic...
High temperature power electronics based on wide-bandgap semiconductors have prominent applications,...
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon at...
Nowadays, the demand for enhanced performance and reliability in micro and nano systems is growing, ...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
In this work a Cu paste consisting in both micro and nanoparticles was produced. The copper paste wa...
Here, the alpha amino acid l-alanine is employed as both a capping and stabilizing agent in the aque...
Nanoparticle agglomerates of passivated Fe (n-Fe) and Fe0.96Cu0.04 (n-Fe0.96Cu0.04), synthesized thr...
Three-dimensional integrated circuits (3D-IC) technology was introduced to solve the interconnect de...
In order to overcome the serious problems posed by Cu ink, which include the strong tendency to the ...
Sub-50 nm copper nanoparticles coated with sub-5 nm 1-octanethiol layer for oxidation inhibition wer...