This thesis reports a study, of the atomical and electrical properties, as function of tilt angle for VLSI technology in silicon. The ion species investigated have been arsenic, antimony and boron. Particular attention has been given to the dose loss and electrical activation as a function of the tilt angle in relation to the annealing conditions and the nature of the samples (crystalline or pre-amorphised). All the wafers have been implanted on the new SWIFT single wafer implanter realised by Applied Materials. Thermawave (TW) measurements performed on all samples implanted with As, B, and Sb show high uniformity of the dose implanted (less than 0.5%) on pre-amoiphised (a-Si) and crystalline silicon (c-Si). Rutherford backscattering spectr...
80 keV B+ ions were implanted in Si with a high-current implanter. The wafers were irradiated at 0...
A differential Hall effect technique has been developed to obtain doping profiles at a depth resolut...
Boron ions were implanted into high resistivity Si wafers at energies in the 15-50 MeV range and dos...
This thesis reports a study, of the atomical and electrical properties, as function of tilt angle fo...
A dose of 5.0x10(14) antimony (Sb+) ions cm(-2) was implanted into silicon wafers at an energy of 70...
A dose of 5.0×1014 antimony (Sb+) ions cm–2 was implanted into silicon wafers at an energy of 70 keV...
Rutherford back-scattering (RBS) and Medium Energy Ion Scattering (MEIS) have been used to determine...
This thesis reports a study of a viable way to produce ultra-shallow n-p junctions for the next gene...
Medium energy ion scattering (MEIS), operated at sub-nm depth resolution in the double alignment con...
This thesis reports the development of two rapid thermal annealing systems, one based on resistive h...
Low energy ion implantation at large tilt angles is an attractive new technology for obtaining ultra...
Arsenic implants performed in Si at ultralow energy have been extensively studied with structural, c...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
The work described in this thesis concerns studies of damage and annealingprocesses in ion implanted...
The level of activation in ultra-shallow As doped Si as a function of the anneal condition has been ...
80 keV B+ ions were implanted in Si with a high-current implanter. The wafers were irradiated at 0...
A differential Hall effect technique has been developed to obtain doping profiles at a depth resolut...
Boron ions were implanted into high resistivity Si wafers at energies in the 15-50 MeV range and dos...
This thesis reports a study, of the atomical and electrical properties, as function of tilt angle fo...
A dose of 5.0x10(14) antimony (Sb+) ions cm(-2) was implanted into silicon wafers at an energy of 70...
A dose of 5.0×1014 antimony (Sb+) ions cm–2 was implanted into silicon wafers at an energy of 70 keV...
Rutherford back-scattering (RBS) and Medium Energy Ion Scattering (MEIS) have been used to determine...
This thesis reports a study of a viable way to produce ultra-shallow n-p junctions for the next gene...
Medium energy ion scattering (MEIS), operated at sub-nm depth resolution in the double alignment con...
This thesis reports the development of two rapid thermal annealing systems, one based on resistive h...
Low energy ion implantation at large tilt angles is an attractive new technology for obtaining ultra...
Arsenic implants performed in Si at ultralow energy have been extensively studied with structural, c...
An ultra high vacuum, low energy ion implanter was used in conjunction with a range of analytical te...
The work described in this thesis concerns studies of damage and annealingprocesses in ion implanted...
The level of activation in ultra-shallow As doped Si as a function of the anneal condition has been ...
80 keV B+ ions were implanted in Si with a high-current implanter. The wafers were irradiated at 0...
A differential Hall effect technique has been developed to obtain doping profiles at a depth resolut...
Boron ions were implanted into high resistivity Si wafers at energies in the 15-50 MeV range and dos...