Various SRAM and MOSFET devices were exposed to 3 MeV and 14 MeV neutrons at a fusion facility and to a fission neutron spectrum with a californium-252 source. Single event burnout (SEB) was observed in several of the MOSFETs in all three environmentsthe first time this phenomenon has been observed at neutron energies below 10 MeV. In addition to observing single event upsets (SEU) and single event latchup (SEL) in the SRAMs, two devices experienced significant multiple cell upset (MCU) effects which dominated the upset rate. The physical mechanisms underlying these phenomena and the consequences for various radiation environments are discussed. © 2011 IEEE
International audienceA sensitivity characterization of a Xilinx Artix-7 field programmable gate arr...
The static random access memory (SRAM) of an ultralow power system-on-chip (SoC) was tested for sing...
International audienceDealing with electronic devices for high reliability applications in terrestri...
Various SRAM and MOSFET devices were exposed to 3 MeV and 14 MeV neutrons at a fusion facility and t...
Eight commercially available n-channel power MOSFETs were exposed to high energy spallation neutrons...
International audienceThis paper presents a single event upset (SEU)sensitivity characterization at ...
Single event upset (SEU) is mainly caused by neutrons in the terrestrial environment. In addition, S...
International audienceThis paper presents an experimental study of the sensitivity to 15-MeV neutron...
International audienceThis paper presents an experimental study of the sensitivity to 15-MeV neutron...
Static random access memory cells (SRAM) are high-speed semiconductor memory that uses flip-flop to...
IEEE Catalog Number: CFP15449-ART (XPLORE) ISBN: 978-1-5090-0232-0 (XPLORE) IEEE Catalog Number: CFP...
During neutron irradiation of 4-Mb SRAMs, large-scale multiple cell upsets (MCUs) were observed. The...
International audienceA sensitivity characterization of a Xilinx Artix-7 field programmable gate arr...
The static random access memory (SRAM) of an ultralow power system-on-chip (SoC) was tested for sing...
International audienceDealing with electronic devices for high reliability applications in terrestri...
Various SRAM and MOSFET devices were exposed to 3 MeV and 14 MeV neutrons at a fusion facility and t...
Eight commercially available n-channel power MOSFETs were exposed to high energy spallation neutrons...
International audienceThis paper presents a single event upset (SEU)sensitivity characterization at ...
Single event upset (SEU) is mainly caused by neutrons in the terrestrial environment. In addition, S...
International audienceThis paper presents an experimental study of the sensitivity to 15-MeV neutron...
International audienceThis paper presents an experimental study of the sensitivity to 15-MeV neutron...
Static random access memory cells (SRAM) are high-speed semiconductor memory that uses flip-flop to...
IEEE Catalog Number: CFP15449-ART (XPLORE) ISBN: 978-1-5090-0232-0 (XPLORE) IEEE Catalog Number: CFP...
During neutron irradiation of 4-Mb SRAMs, large-scale multiple cell upsets (MCUs) were observed. The...
International audienceA sensitivity characterization of a Xilinx Artix-7 field programmable gate arr...
The static random access memory (SRAM) of an ultralow power system-on-chip (SoC) was tested for sing...
International audienceDealing with electronic devices for high reliability applications in terrestri...