Bridge percolation as a way to electrically connect discontinued conducting blocks using metallic nanowires

We present the design of a new hybrid material which combines sparse metallic nanowire networks and fractured Indium Tin Oxide (ITO) films on flexible polymer substrates. The strong increase of the film sheet resistance due to the formation of linear cracks resulting from mechanical bending along an axis parallel to the substrate was significantly mitigated by the subsequent coverage of the damaged surface with a random network of silver nanowires obtained from a low-cost deposition scheme. Using a complementary approach including formal analytical derivations, Monte-Carlo simulations and electrical circuit representation for the modeling of bridged-percolating nanowire networks, we unveil the key relations between crack linear density, nanowire length and network areal density that ensure electrical percolation through the hybrid. This work introduces an original concept leading to the design of a novel material that has the potential to push back the limits of ITO as a conducting transparent material for flexible applications while addressing the issue of material supply criticality for Indium