By minimizing surface states with sulfur passivation, a record-high Schottky barrier is achieved with nickel on n-type Si(1 0 0) surface. Capacitance-voltage measurements yield a flat-band barrier height of 0.97 eV. Activation-energy and current-voltage measurements indicate ∼0.2-eV lower barriers for the Ni/Si(1 0 0) junction. These results accompany a previously-reported record-high Schottky barrier of 1.1 eV between aluminum and S-passivated p-type Si(1 0 0) surface. The operation of these metal/Si(1 0 0) junctions changes from majority-carrier conduction, i.e., a Schottky junction, to minority-carrier conduction, i.e., a p-n junction, with the increase in barrier height from 0.97 eV to 1.1 eV. Temperature-dependent current-voltage measu...
As the device geometry dramatically shrinks, the silicide/Si contact resistance on source/drain regi...
A Ni/n-Si Schottky barrier diode was produced by electrodeposition technique from the electrolyte co...
The Schottky junction source/drain structure has great potential to replace the traditional p/n junc...
Aluminum and nickel contacts were prepared by evaporation on sulfur-passivated n - and p -type Si (1...
We report a high Schottky-barrier between Al and S-passivated p-type Si(100) surface. Capacitance-vo...
A wet-chemical process has been developed to passivate the S i(100) surface with S in an aqueous sol...
In this paper, Ni(Pt)Si film is formed using the structure Ni/Pt/Ni/Si after the RTA, and the sheet ...
As continued MOSFETs scaling becomes increasingly challenging, solutions are urgently needed to meet...
In most solar cells built on p-type Si, the p-n junction or emitter is formed by P diffusion. The hi...
Schottky barriers at metal-semiconductor interfaces have attracted much interest in recent years. On...
In this paper, Ni(Pt)Si film is formed using the structure Ni/Pt/Ni/Si after the RTA, and the sheet ...
In this paper, Ni(Pt)Si film is formed using the structure Ni/Pt/Ni/Si after the RTP, and the sheet ...
The authors have calculated the Schottky barrier heights for the type A and type B NiSi2-Si(111) int...
In this paper. we present a detailed study of nickel-silicide source and drain Schottky barrier MOSF...
The evolution of barrier at Schottky contact and its stabilization to value characterized by the bar...
As the device geometry dramatically shrinks, the silicide/Si contact resistance on source/drain regi...
A Ni/n-Si Schottky barrier diode was produced by electrodeposition technique from the electrolyte co...
The Schottky junction source/drain structure has great potential to replace the traditional p/n junc...
Aluminum and nickel contacts were prepared by evaporation on sulfur-passivated n - and p -type Si (1...
We report a high Schottky-barrier between Al and S-passivated p-type Si(100) surface. Capacitance-vo...
A wet-chemical process has been developed to passivate the S i(100) surface with S in an aqueous sol...
In this paper, Ni(Pt)Si film is formed using the structure Ni/Pt/Ni/Si after the RTA, and the sheet ...
As continued MOSFETs scaling becomes increasingly challenging, solutions are urgently needed to meet...
In most solar cells built on p-type Si, the p-n junction or emitter is formed by P diffusion. The hi...
Schottky barriers at metal-semiconductor interfaces have attracted much interest in recent years. On...
In this paper, Ni(Pt)Si film is formed using the structure Ni/Pt/Ni/Si after the RTA, and the sheet ...
In this paper, Ni(Pt)Si film is formed using the structure Ni/Pt/Ni/Si after the RTP, and the sheet ...
The authors have calculated the Schottky barrier heights for the type A and type B NiSi2-Si(111) int...
In this paper. we present a detailed study of nickel-silicide source and drain Schottky barrier MOSF...
The evolution of barrier at Schottky contact and its stabilization to value characterized by the bar...
As the device geometry dramatically shrinks, the silicide/Si contact resistance on source/drain regi...
A Ni/n-Si Schottky barrier diode was produced by electrodeposition technique from the electrolyte co...
The Schottky junction source/drain structure has great potential to replace the traditional p/n junc...