Add to ORKGIn this paper, we present a 3D-mesh architecture which is utilized as a processor-memory interconnection system to increase the throughput of memory system currently used on line cards. The 3D-mesh architecture is integrated on the line card to allow communication among multiple processing elements to multiple shared memories. The 3D-mesh provides many desirable performance qualities such as low latency, off-chip scalability, and most important higher memory bandwidth than its counterpart - the single shared-bus
Abstract—Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Thre...
The performance of most digital systems today is limited by the interconnect latency between logic a...
In this work, we present off-chip communications architectures for line cards to increase the throug...
In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to incr...
In this paper, we propose two off-chip interconnect architectures, called 3D-interconnects, to commu...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
As Moore’s Law slows down, new integration technologies emerge, such as 3D integration, silicon inte...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
none5Shared L1 memories are of interest for tightly-coupled processor clusters in programmable accel...
Three-Dimensional (3D) silicon integration is an emerging technology that vertically stacks multiple...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors a...
Shared L1 memories are of interest for tightlycoupled processor clusters in programmable accelerator...
Abstract—Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Thre...
The performance of most digital systems today is limited by the interconnect latency between logic a...
In this work, we present off-chip communications architectures for line cards to increase the throug...
In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to incr...
In this paper, we propose two off-chip interconnect architectures, called 3D-interconnects, to commu...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
Deep layer processing and increasing line rates present a memory challenge to processor-memory commu...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
In this paper, we propose two hypercube-based, off-chip interconnect architectures, called 3D-interc...
As Moore’s Law slows down, new integration technologies emerge, such as 3D integration, silicon inte...
International audienceShared L1 memories are of interest for tightly-coupled processor clusters in p...
none5Shared L1 memories are of interest for tightly-coupled processor clusters in programmable accel...
Three-Dimensional (3D) silicon integration is an emerging technology that vertically stacks multiple...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors a...
Shared L1 memories are of interest for tightlycoupled processor clusters in programmable accelerator...
Abstract—Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Thre...
The performance of most digital systems today is limited by the interconnect latency between logic a...
In this work, we present off-chip communications architectures for line cards to increase the throug...