An Image Analysis Technique For Assessing Particle Size And Agglomeration Tendency Of Slurries

Understanding the time-dependent behavior and size of particulate systems, specifically, particles in abrasive slurries, is a key part of chemical mechanical polishing (CMP). Microscopy and image analysis enables both qualitative and quantitative analysis of particle interaction behavior in diluted samples of such particulate suspensions. A technique using microscopy and image analysis has been developed specific to the analysis of suspensions of, micron size or larger, abrasive particle slurry systems. This technique has been applied to aluminum oxide (Al2O3) slurries and measurements of particle size and stability have been obtained with good accuracy and precision