A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal coupling is presented in terms of interconnect width, substrate thickness, interconnect line spacing, and frequency. Picosecond photoconductor based measurements of coupled transmission lines on the integrated circuit support the even and odd mode signal transmission simulation results. SPICE circuit simulation is used to demonstrate the model utility and explore the sensitivity of the self- and mutual capacitances and inductances in signal crosstalk. © 1991 Taylor & Francis Ltd
The rapid development of high-speed, high-density integrated circuits has brought about a situation ...
Empirical equations for the self and mutual capacitance and inductance (C., C, L, L,) of coupled mic...
International audienceOne of the major problems in electromagnetic compatibility is the interference...
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
Abstract—Analytical compact form models for the signal transients and crosstalk noise of inductive-e...
Analytical compact-form models for the signal transients and crosstalk noise of inductive-effect-pro...
International audienceConstant evolution in integrated circuit technology has led to an increase in ...
Abstract—Analytical compact-form models for the signal tran-sients and crosstalk noise of inductive-...
Propagation delays and couplings between nearby lines affect the circuit performances (speed, power ...
This paper investigates and measures the near end and far end crosstalk in the multiconductor transm...
In multi-layer circuit boards of modern electronic equipment, signal lines and power distribution tr...
Crosstalk within cable bundles can degrade system performance. In systems that use shielded twisted-...
Abstract—The goal of this work was to simulate the effect of the finite conductivity of semiconducto...
A new efficient analytical eye-diagram determination technique for coupled interconnect lines is pre...
Abstract—A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects...
The rapid development of high-speed, high-density integrated circuits has brought about a situation ...
Empirical equations for the self and mutual capacitance and inductance (C., C, L, L,) of coupled mic...
International audienceOne of the major problems in electromagnetic compatibility is the interference...
A coupled interconnect model is developed using even mode and odd mode capacitance analysis. Signal ...
Abstract—Analytical compact form models for the signal transients and crosstalk noise of inductive-e...
Analytical compact-form models for the signal transients and crosstalk noise of inductive-effect-pro...
International audienceConstant evolution in integrated circuit technology has led to an increase in ...
Abstract—Analytical compact-form models for the signal tran-sients and crosstalk noise of inductive-...
Propagation delays and couplings between nearby lines affect the circuit performances (speed, power ...
This paper investigates and measures the near end and far end crosstalk in the multiconductor transm...
In multi-layer circuit boards of modern electronic equipment, signal lines and power distribution tr...
Crosstalk within cable bundles can degrade system performance. In systems that use shielded twisted-...
Abstract—The goal of this work was to simulate the effect of the finite conductivity of semiconducto...
A new efficient analytical eye-diagram determination technique for coupled interconnect lines is pre...
Abstract—A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects...
The rapid development of high-speed, high-density integrated circuits has brought about a situation ...
Empirical equations for the self and mutual capacitance and inductance (C., C, L, L,) of coupled mic...
International audienceOne of the major problems in electromagnetic compatibility is the interference...