The presence of particles on surfaces can be a strong problem in terms of pollution (optics), defect (microelectronics) or security (nuclear). In this context, the removal of highly adhering particles from surfaces (silicon or other materials) remains a challenge. Many studies have been performed in the field of microelectronics to evaluate the potentiality of various cleaning techniques. Among them, dry laser cleaning appeared as a very powerful process to eject small particles from surfaces. The purpose of this work is to apply this technique in the frame of the ITER project to remove C, W and Be particles from the reactor walls. The aim of this presentation is to describe the laser-induced particle removal technique based on fast energy ...
Laser Cleaning (SLC) process. Using a frequency doubled, Q-switched Nd:YAG laser (FWHM=8 ns) we remo...
Dry laser cleaning (DLC) is considered as an escape from an adhesion potential under the forces indu...
A model for nanosecond dry laser cleaning that treats the substrate and particle expansion on a unif...
The presence of particles on surfaces can be a strong problem in terms of pollution (optics), defect...
19th International Conference on Plasma-Surface Interactions in Controlled Fusion Devices (PSI), Uni...
The preparation of surfaces free of particle contamination is one of the crucial prerequisites for a...
International audienceWe report on experimental investigations on the role of humidity in the laser ...
During tokamak operation, plasma-wall interactions lead to material erosion process and dusts produc...
The cleaning of silicon surfaces from submicron dust particles has been studied by means of the Ste...
The continuing trend towards miniaturization of integrated circuits requires increasing effots and n...
We report on experiments on the underlying physical mechanisms in the Dry- (DLC) and Steam Laser Cle...
As semiconductor and microelectronic devices are becoming increasingly smaller, surface contaminatio...
A model for ns dry laser cleaning that treats the substrate and particle expansion on a unified basi...
The continuing trend towards miniaturization of integrated circuits requires increasing effom and ne...
Abstract { We have studied the removal of submicrometer particles from silicon wafers by the steam l...
Laser Cleaning (SLC) process. Using a frequency doubled, Q-switched Nd:YAG laser (FWHM=8 ns) we remo...
Dry laser cleaning (DLC) is considered as an escape from an adhesion potential under the forces indu...
A model for nanosecond dry laser cleaning that treats the substrate and particle expansion on a unif...
The presence of particles on surfaces can be a strong problem in terms of pollution (optics), defect...
19th International Conference on Plasma-Surface Interactions in Controlled Fusion Devices (PSI), Uni...
The preparation of surfaces free of particle contamination is one of the crucial prerequisites for a...
International audienceWe report on experimental investigations on the role of humidity in the laser ...
During tokamak operation, plasma-wall interactions lead to material erosion process and dusts produc...
The cleaning of silicon surfaces from submicron dust particles has been studied by means of the Ste...
The continuing trend towards miniaturization of integrated circuits requires increasing effots and n...
We report on experiments on the underlying physical mechanisms in the Dry- (DLC) and Steam Laser Cle...
As semiconductor and microelectronic devices are becoming increasingly smaller, surface contaminatio...
A model for ns dry laser cleaning that treats the substrate and particle expansion on a unified basi...
The continuing trend towards miniaturization of integrated circuits requires increasing effom and ne...
Abstract { We have studied the removal of submicrometer particles from silicon wafers by the steam l...
Laser Cleaning (SLC) process. Using a frequency doubled, Q-switched Nd:YAG laser (FWHM=8 ns) we remo...
Dry laser cleaning (DLC) is considered as an escape from an adhesion potential under the forces indu...
A model for nanosecond dry laser cleaning that treats the substrate and particle expansion on a unif...