Electromagnetic Interference and Compatibility

Due to the continuous progress in semiconductor technology and the rapidly evolving application scenarios, electromagnetic compatibility (EMC) is constantly raising new challenges and is a very dynamic field of research. In this context, this collection of papers, originally published in the “Electromagnetic Interference and Compatibility” Special Issue of Electronics for which I served as a Guest Editor, offers a vivid picture of the EMC research challenges and directions over the last years in this complex and multifaceted field. Focusing on EMC in communication systems, the paper “Interference of Spread-Spectrum EMI and Digital Data Links under Narrowband Resonant Coupling” by Crovetti and Musolino highlights how traditional methods like spread-spectrum clock modulation, developed with reference to AM and FM radio receivers, are no longer well suited to digital communications. In the very crucial field of EMC in power electronics, the paper “Signal Transformations for Analysis of Supraharmonic EMI Caused by Switched-Mode Power Supplies” by Sandrolini and Mariscotti explores advanced signal processing techniques (Wavelet Packet Transform and the Empirical Mode Decomposition) in the analysis of electromagnetic emissions of power converters, while in “Modeling and Optimization of Impedance Balancing Technique for Common Mode Noise Attenuation in DC-DC Boost Converters,” by Shuaitao Zhang et al. more conventional balancing techniques are optimized to attenuate common-mode emissions. For new application scenarios, EMC challenges in emerging electric vehicles are addressed in “Electromagnetic Susceptibility of Battery Management Systems’ ICs for Electric Vehicles: Experimental Study,” by Aiello. Moreover, IC-level EMC issues in operational amplifiers are addressed in “EMI Susceptibility of the Output Pin in CMOS Amplifiers” by Richelli, Colalongo,and Kovacs-Vajna, and the susceptibility of Hall Effect sensors is studied in “Hall-Effect Curren Sensors Susceptibility to EMI: Experimental Study” by Aiello. New contributions in the area of cross-talk reduction and signal/power integrity are presented in “A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over” by Jung-Han Lee and in “A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards” by Myunghoi Kim. The active research area on the EMC properties of materials and their application to the suppression of interference is represented in this volume by “Shielding Properties of Cement Composites Filled with Commercial Biochar” by Yasir et al. and by “Synthesis and Characterization of Polyaniline-Based Composites for Electromagnetic Compatibility of Electronic Devices” by Gareev et al. Last, but not least, new contributions on ferrite cores and their characterization are presented in “Performance Study of Split Ferrite Cores Designed for EMI Suppression on Cables” by Suarez et al. and in “Simple Setup for Measuring the Response to Differential Mode Noise of Common Mode Chokes” by Gonzalez-Vizuete ´ et al. Though not exhaustive, the papers collected in this volume can be useful to address practical EMC problems and stimulate future research and should be well received by the EMC communit