Modification of liquid/solid interface shape in directionally solidifying Al-Cu alloys by a transverse magnetic field.

International audienceAl-0.85wt%Cu and Al-2.5wt%Cu alloys were directionally solidified under different transverse magnetic field (TMF) intensities to investigate the influence of TMF on the liquid/solid interface shape with respect to the various length scales appearing (planar, cellular, and dendritic interfaces). Results show that planar and cellular interfaces tilt to one side and then level off with increasing TMF although the dendritic interface appears not to behave in this manner. In situ synchrotron X-ray imaging was applied during directional solidification of the Al-4wt%Cu alloy under a 0.08T TMF, revealing leveling of the initially sloped interface. Solute redistribution, caused by thermoelectric magnetic convection (TEMC), responds to the changes in the interface shape. Because different typical length scales should be used in estimating the velocity of TEMC for planar, cellular, and dendritic interfaces, the maximum velocity of the convection ahead of the interface is obtained under different TMF intensities; correspondingly, leveling of the interface's degree of slop varies with TMF