Charge transport in thick amorphous silicon dioxide capacitors for integrated galvanic insulators is experimentally investigated and analyzed through numerical simulations carried out with a commercial TCAD tool. The material intrinsic defectivity and the large biases applied to such devices give rise to a leakage current which is responsible of degradation and failure. Hence it is crucial to have a complete understanding of the charge-transport main physical mechanisms in amorphous silicon oxide. For this reason, constant-current time dependent dielectric breakdown measurements have been performed on thick metal-insulator-metal structures and, in order to gain insight on the role of defects on breakdown, numerical simulations have been com...
International audienceIn this study, we have investigated the electrical properties of the failure m...
Lai Kam Kwong.Thesis (M.Sc.)--Chinese University of Hong Kong.Bibliography: leaves 86-89
We show measurement results and simulations of current–voltage characteristics of Metal-Oxide-Semico...
A TCAD approach for the investigation of charge transport in thick amorphous silicon dioxide is pres...
This chapter updates Chapter 6 of Volume 1 and reviews the testing methods used for characterizing t...
Amorphous dielectrics of different thicknesses (nm to mm) are used in various applications. Low temp...
The effects of stressing high quality polysilicon--SiO2-Si capacitors with a constant d-c current, a...
Despite extensive experimental and theoretical studies, the atomistic mechanisms responsible for die...
The ramped-field technique has been widely used for determining dielectric breakdown in thin insulat...
We have compared the thermal damage in ultrathin gate SiO2 layers of 5.6 and 3 nm thickness after in...
Charge breakdown of Ar-O2 thermal grown SiO2 was investigated by time dependent dielectric breakdown...
We present a quantitative physical model describingthe current evolution due to the formation of a c...
When an ultrathin (<5 nm) oxide is subjected to electrical stress, several soft-breakdown events can...
We present a quantitative physical model describing degradation of poly-crystalline HfO2 dielectric...
Defect current of ultrathin oxides after degradation and breakdown was investigated by defect band s...
International audienceIn this study, we have investigated the electrical properties of the failure m...
Lai Kam Kwong.Thesis (M.Sc.)--Chinese University of Hong Kong.Bibliography: leaves 86-89
We show measurement results and simulations of current–voltage characteristics of Metal-Oxide-Semico...
A TCAD approach for the investigation of charge transport in thick amorphous silicon dioxide is pres...
This chapter updates Chapter 6 of Volume 1 and reviews the testing methods used for characterizing t...
Amorphous dielectrics of different thicknesses (nm to mm) are used in various applications. Low temp...
The effects of stressing high quality polysilicon--SiO2-Si capacitors with a constant d-c current, a...
Despite extensive experimental and theoretical studies, the atomistic mechanisms responsible for die...
The ramped-field technique has been widely used for determining dielectric breakdown in thin insulat...
We have compared the thermal damage in ultrathin gate SiO2 layers of 5.6 and 3 nm thickness after in...
Charge breakdown of Ar-O2 thermal grown SiO2 was investigated by time dependent dielectric breakdown...
We present a quantitative physical model describingthe current evolution due to the formation of a c...
When an ultrathin (<5 nm) oxide is subjected to electrical stress, several soft-breakdown events can...
We present a quantitative physical model describing degradation of poly-crystalline HfO2 dielectric...
Defect current of ultrathin oxides after degradation and breakdown was investigated by defect band s...
International audienceIn this study, we have investigated the electrical properties of the failure m...
Lai Kam Kwong.Thesis (M.Sc.)--Chinese University of Hong Kong.Bibliography: leaves 86-89
We show measurement results and simulations of current–voltage characteristics of Metal-Oxide-Semico...