This paper presents a design and experimental validation of a temperature feedback control scheme to realize the reduction of temperature variation amplitude of power devices or modules. A full-order observer state-space thermal model enables estimation and control of the temperature at reliability critical locations only measuring one accessible location. © 2013 IEEE
Semiconductor power switches are largely considered the most fragile components in power electronic ...
Power Semiconductors undergo thermal stress during operation, which is caused by thermal cycling. Th...
Active thermal control is crucial in achieving the required accuracy and throughput in many industri...
This paper presents a design and experimental validation of a temperature feedback control scheme to...
This paper presents an advanced dynamic cooling strategy for multi-layer structured power electronic...
This paper presents an advanced dynamic cooling strategy for multi-layer structured power electronic...
In this paper, a reduced order thermal observer with disturbance estimation is applied for temperatu...
Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility...
One of the most important causes of the failure of power electronic modules is thermal stress. Prope...
Residual lifetime estimation has gained a key point among the techniques that improve the reliabilit...
Residual lifetime estimation has gained a key point among the techniques that improve the reliabilit...
This work proposes an Active Thermal Control (ATC) of power switches. Leveraging on the fact that th...
Active Thermal Control (ATC) consists in driving power switches in a less efficient way when low loa...
Power amplifier transistors suffer from overheating when they operate under extreme conditions. To p...
Semiconductor power switches are largely considered the most fragile components in power electronic ...
Power Semiconductors undergo thermal stress during operation, which is caused by thermal cycling. Th...
Active thermal control is crucial in achieving the required accuracy and throughput in many industri...
This paper presents a design and experimental validation of a temperature feedback control scheme to...
This paper presents an advanced dynamic cooling strategy for multi-layer structured power electronic...
This paper presents an advanced dynamic cooling strategy for multi-layer structured power electronic...
In this paper, a reduced order thermal observer with disturbance estimation is applied for temperatu...
Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility...
One of the most important causes of the failure of power electronic modules is thermal stress. Prope...
Residual lifetime estimation has gained a key point among the techniques that improve the reliabilit...
Residual lifetime estimation has gained a key point among the techniques that improve the reliabilit...
This work proposes an Active Thermal Control (ATC) of power switches. Leveraging on the fact that th...
Active Thermal Control (ATC) consists in driving power switches in a less efficient way when low loa...
Power amplifier transistors suffer from overheating when they operate under extreme conditions. To p...
Semiconductor power switches are largely considered the most fragile components in power electronic ...
Power Semiconductors undergo thermal stress during operation, which is caused by thermal cycling. Th...
Active thermal control is crucial in achieving the required accuracy and throughput in many industri...